Ding Ruizhe, Luo Haiyan, Li Zhiwei, Zhou Zuoda, Qu Dingjun, Xiong Wei
Hefei Institutes of Physical Science, Chinese Academy of Sciences, Hefei 230031, China.
Science Island Branch, Graduate School of USTC, Hefei 230026, China.
Micromachines (Basel). 2023 Aug 7;14(8):1568. doi: 10.3390/mi14081568.
Detecting and classifying defects on unpatterned wafers is a key part of wafer front-end inspection. Defect inspection schemes vary depending on the type and location of the defects. In this paper, the structure of the prototype is designed to meet the requirements of wafer surface and edge defect inspection. This prototype has four inspection channels: scattering, reflection, phase, and contour, with two working conditions: surface and edge inspection. The key structure of the prototype was simulated using Ansys. The simulation results show that the maximum deformation of the optical detection subsystem is 19.5 μm and the fundamental frequency of the prototype is 96.9 Hz; thus, these results meet the requirements of optical performance stability and structural design. The experimental results show that the prototype meets the requirements of the inspection sensitivity better than 200 nm equivalent PSL spherical defects.
检测和分类无图案晶圆上的缺陷是晶圆前端检测的关键部分。缺陷检测方案因缺陷类型和位置而异。本文设计了原型结构以满足晶圆表面和边缘缺陷检测的要求。该原型有四个检测通道：散射、反射、相位和轮廓，有两种工作条件：表面和边缘检测。使用Ansys对原型的关键结构进行了模拟。模拟结果表明，光学检测子系统的最大变形为19.5μm，原型的基频为96.9Hz；因此，这些结果满足光学性能稳定性和结构设计的要求。实验结果表明，该原型满足检测灵敏度优于200nm等效PSL球形缺陷的要求。
