Zhang Jiabao, Yang Xudong, Li Zhipeng, Cai Jixiang, Zhang Jianfei, Han Xiaodong
Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, China.
College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China.
Micromachines (Basel). 2023 Aug 31;14(9):1708. doi: 10.3390/mi14091708.
In situ TEM mechanical stages based on micro-electromechanical systems (MEMS) have developed rapidly over recent decades. However, image-based quantification of MEMS mechanical stages suffers from the trade-off between spatial and temporal resolutions. Here, by taking in situ TEM nanoindentation as an example, we developed a novel method for image-based quantified in situ TEM mechanical tests with both high spatial and temporal resolutions. A reference beam was introduced to the close vicinity of the indenter-sample region. By arranging the indenter, the sample, and the reference beam in a micron-sized area, the indentation depth and load can be directly and dynamically acquired from the relative motion of markers on the three components, while observing the indentation process at a relatively high magnification. No alteration of viewing area is involved throughout the process. Therefore, no deformation events will be missed, and the collection rate of quantification data can be raised significantly.
基于微机电系统（MEMS）的原位透射电子显微镜机械平台在近几十年中发展迅速。然而，基于图像的MEMS机械平台定量分析存在空间分辨率和时间分辨率之间的权衡。在此，以原位透射电子显微镜纳米压痕为例，我们开发了一种新方法，用于基于图像的具有高空间分辨率和时间分辨率的原位透射电子显微镜机械测试。将一束参考光束引入压头-样品区域的紧邻处。通过将压头、样品和参考光束布置在一个微米级区域内，在以相对较高放大倍数观察压痕过程的同时，可从三个部件上标记的相对运动直接动态获取压痕深度和载荷。整个过程不涉及观察区域的改变。因此，不会错过任何变形事件，并且可以显著提高定量数据的采集率。
