Esa Zulfikre, Nauman Malik Muhammad, Jin Lei, Khalid Muhammad Usman, Hj Zaini Juliana, Iqbal Asif, Ali Kamran, Aïssa Brahim, Rosei Federico
Faculty of Integrated Technologies, Universiti Brunei Darussalam, Bandar Seri Begawan, BE 1410, Brunei Darussalam.
Centre for Energy, Materials and Telecommunications, Institut National de la Recherche Scientifique, 1650 Boul. Lionel-Boulet, Varennes, QC, J3X 1P7, Canada.
Sci Rep. 2023 Sep 28;13(1):16319. doi: 10.1038/s41598-023-43113-x.
Additive manufacturing (AM) enables the production of high value and high performance components with applications from aerospace to biomedical fields. We report here on the fabrication of poly(3-hexylthiophene): phenyl-C-butyric acid methyl ester (P3HT:PCBM) thin films through the electrohydrodynamic atomization (EHDA) process and its integration as absorber layer for organic solar cells. Prior to the film fabrication, the optimization of the process was carried out by developing the operating envelope for the P3HT:PCBM ink to determine the optimal flow rate and the appropriate applied voltage to achieve a stable-cone deposition mode. The EHDA printed thin-film's topography, morphology and optical properties were systematically analyzed. The root-mean-square roughness was found to vary significantly with the annealing temperature and the flow rate and ranged from 1.938 to 3.345 nm. The estimated film mass and thickness were found between 3.235 and 23.471 mg and 597.5 nm to 1.60 µm, respectively. The films exhibited a broad visible absorption spectrum ranging from ~ 340 to ~ 600 nm, with a maximum peak λ located at ~ 500 nm. As the annealing temperature and the flow rate were increased, discernible alterations in the PCBM clusters were consequently observed in the blends of the film and the size of the PCBM clusters has decreased by 3% while the distance between them was highly reduced by as much as 82%.
增材制造(AM)能够生产具有高价值和高性能的部件,其应用涵盖从航空航天到生物医学等领域。我们在此报告通过电液动力雾化(EHDA)工艺制备聚(3-己基噻吩):苯基-C-丁酸甲酯(P3HT:PCBM)薄膜及其作为有机太阳能电池吸收层的集成情况。在制备薄膜之前,通过开发P3HT:PCBM油墨的操作范围来进行工艺优化,以确定实现稳定锥形沉积模式的最佳流速和合适的施加电压。系统地分析了EHDA印刷薄膜的形貌、形态和光学性质。发现均方根粗糙度随退火温度和流速显著变化,范围为1.938至3.345纳米。估计薄膜质量和厚度分别在3.235至23.471毫克和597.5纳米至1.60微米之间。薄膜在约340至约600纳米范围内呈现出较宽的可见吸收光谱,最大峰值λ位于约500纳米处。随着退火温度和流速的增加,在薄膜混合物中观察到PCBM团簇有明显变化,PCBM团簇的尺寸减小了3%,而它们之间的距离大幅减少了多达82%。