Ozaslan Sanem, Celiksoz Ozge, Tepe Hatice, Tavas Begum, Yaman Batu Can
Department of Restorative Dentistry, Eskisehir Osmangazi University Faculty of Dentistry, Eskisehir, TUR.
Cureus. 2023 Aug 29;15(8):e44309. doi: 10.7759/cureus.44309. eCollection 2023 Aug.
The aim of the present study is to compare the repair bond strengths (RBSs) of Cention-N (light-cure and self-cure modes), Equia Forte HT Fil and a nanohybrid resin composite.
Equia Forte HT Fil (GC, Tokyo, Japan), Cention-N (Ivoclar Vivadent, Schaan, Liechtenstein) and Filtek Z550 (3M ESPE, St Paul, MN, USA) were used in this study. Equia Forte HT Fil (EQF), Cention-N self-cure (CSC), Cention-N light-cure (CLC) and Filtek Z550 (Z550) groups were formed. A total of 40 samples were prepared; 10 samples in each group (n = 10). After the polymerization was completed according to the manufacturer's instructions, the samples were polished with OptiDisc (Kerr Corporation, Orange, USA) for 5 s each, from extra-course to extra-fine. After all samples were stored in 37°C water for 24 h, 10,000 cycles of brushing simulator and thermal cycles were applied to the samples. The samples were prepared in accordance with the selected repair protocol, and microshear bond strength (µSBS) test was performed. Fracture analysis on debonded surfaces was visualized by scanning electron microscopy. The conformity of the data to normal distribution was analyzed by the Shapiro-Wilk test. Multiple comparisons were performed using Dunn's test.
Z550 showed significantly higher µSBS as compared to the other three groups. There is no difference between CSC, CLC and EQF.
The use of Cention-N's self-cure or light-cure mode did not affect the RBS values. The RBS values of Cention-N and Equia Forte HT Fil materials are lower than those of the composite resin material.
本研究旨在比较Cention-N（光固化和自固化模式）、Equia Forte HT Fil和一种纳米混合树脂复合材料的修复粘结强度（RBS）。
本研究使用了Equia Forte HT Fil（日本东京GC公司）、Cention-N（列支敦士登沙恩义获嘉伟瓦登特公司）和Filtek Z550（美国明尼苏达州圣保罗3M ESPE公司）。形成了Equia Forte HT Fil（EQF）组、Cention-N自固化（CSC）组、Cention-N光固化（CLC）组和Filtek Z550（Z550）组。共制备了40个样本；每组10个样本（n = 10）。按照制造商的说明完成聚合后，用OptiDisc（美国奥兰治科尔公司）将样本从粗到细各打磨5秒。所有样本在37°C水中储存24小时后，对样本施加10000次刷牙模拟器循环和热循环。按照选定的修复方案制备样本，并进行微剪切粘结强度（µSBS）测试。通过扫描电子显微镜观察脱粘表面的断裂分析。通过Shapiro-Wilk检验分析数据是否符合正态分布。使用邓恩检验进行多重比较。
与其他三组相比，Z550的µSBS显著更高。CSC、CLC和EQF之间没有差异。
Cention-N的自固化或光固化模式的使用不影响RBS值。Cention-N和Equia Forte HT Fil材料的RBS值低于复合树脂材料。
