Department of Conservative Dentistry and Periodontology, University Hospital Regensburg, Regensburg, Germany.
Private Practice, Biberach an der Riß, Germany.
Caries Res. 2024;58(1):17-29. doi: 10.1159/000534349. Epub 2023 Oct 5.
Red-fluorescing dentine indicates bacterial contamination [Caries Res 2002; 36: 315-319]. We investigated effect of removal of red fluorescent dentine caries on shear bond strength and fracture mode of 4 adhesive approaches. Sixty-five carious teeth and 50 noncarious controls were distributed into 4 groups: Clearfil™ self-etch (CSE), OptiBond™ FL total etch (OTE), Scotchbond™ Universal total etch (STE) and self-etch (SSE). Samples were excited at 405 nm and viewed through 530 nm filter. Carious samples were ground flat exposing strongly red-fluorescing (StrongRF) dentine, on which a composite cylinder was placed, using one of 4 adhesives. After 22 h in water, shear bond strength and fracture mode were analysed. StrongRF was removed; composite cylinders were placed on weakly red-fluorescing (WeakRF) dentine and tested as described above. Finally, red-fluorescing dentine was removed, and composite cylinders were placed on non-fluorescing (NonRF) dentine and tested. Composites were placed at 3 corresponding heights in controls. After 22 h in water, shear bond strength testing and fracture mode analysis were performed. Differences were tested using Mann-Whitney or Wilcoxon tests (p ≤0.05). Median (Q1, Q3) shear bond strength on StrongRF was SSE 14.4 (9.2, 18.2) MPa >CSE 10.2 (6.4, 17.3) MPa >STE 9.1 (6.9, 11.2) MPa >OTE 6.8 (4.0, 10.8) MPa. Shear bond strength increased statistically significantly for all adhesives on WeakRF: SSE 19.8 (13.6, 24.3) MPa >STE 19.5 (12.7, 23.1) MPa >CSE 17.5 (12.0, 22.5) MPa >OTE 15.8 (11.9, 20.9) MPa. Only STE 25.6 (22.4, 29.1) MPa and CSE 22.1 (17.6, 24.6) MPa were significantly different on NonRF compared to WeakRF. For controls tested at corresponding depths, superficial shear bond strength was OTE 18.7 (16.0, 22.1) MPa >STE 18.4 (12.0, 25.9) MPa >CSE 18.1 (12.7, 20.7) MPa >SSE 13.0 (9.6, 17.8) MPa. This was significantly higher compared to StrongRF except for SSE. Central shear bond strength was not significantly different to WeakRF, deep shear bond strength was significantly lower for SSE and CSE but higher for OTE compared to carious. Conclusion: StrongRF dentine should be removed for higher shear bond strength, but WeakRF dentine can often be preserved without compromising adhesive bond strength.
红色荧光牙本质表明存在细菌污染[Caries Res 2002; 36: 315-319]。我们研究了去除红色荧光龋损牙本质对 4 种粘接方法的剪切粘接强度和断裂模式的影响。将 65 颗龋损牙和 50 颗非龋损牙分为 4 组：Clearfil™自酸蚀（CSE）、OptiBond™ FL 全酸蚀（OTE）、Scotchbond™ Universal 全酸蚀（STE）和自酸蚀（SSE）。样品在 405nm 下激发，通过 530nm 滤光片观察。将龋损样本磨平，暴露出强烈红色荧光（StrongRF）牙本质，在其上放置一个复合圆柱体，使用 4 种粘接剂中的一种。在水中放置 22 小时后，分析剪切粘接强度和断裂模式。去除 StrongRF；将复合圆柱体放在弱红色荧光（WeakRF）牙本质上，并按上述方法进行测试。最后，去除红色荧光牙本质，并将复合圆柱体放在非荧光（NonRF）牙本质上进行测试。对照组中在相应的 3 个高度放置复合材料。在水中放置 22 小时后，进行剪切粘接强度测试和断裂模式分析。使用曼-惠特尼或威尔科克森检验（p≤0.05）检验差异。StrongRF 上 SSE 的中位（Q1，Q3）剪切粘接强度为 14.4（9.2，18.2）MPa＞CSE 为 10.2（6.4，17.3）MPa＞STE 为 9.1（6.9，11.2）MPa＞OTE 为 6.8（4.0，10.8）MPa。所有粘接剂在 WeakRF 上的剪切粘接强度均呈统计学显著增加：SSE 为 19.8（13.6，24.3）MPa＞STE 为 19.5（12.7，23.1）MPa＞CSE 为 17.5（12.0，22.5）MPa＞OTE 为 15.8（11.9，20.9）MPa。与 WeakRF 相比，仅 STE 为 25.6（22.4，29.1）MPa 和 CSE 为 22.1（17.6，24.6）MPa 有统计学显著差异。在相应深度测试的对照组中，表面剪切粘接强度为 OTE 为 18.7（16.0，22.1）MPa＞STE 为 18.4（12.0，25.9）MPa＞CSE 为 18.1（12.7，20.7）MPa＞SSE 为 13.0（9.6，17.8）MPa。与 StrongRF 相比，这明显更高，除了 SSE。中央剪切粘接强度与 WeakRF 无显著差异，深层剪切粘接强度 SSE 和 CSE 显著降低，但 OTE 与龋损相比显著升高。结论：为了获得更高的剪切粘接强度，应去除 StrongRF 牙本质，但通常可以保留 WeakRF 牙本质而不会影响粘接强度。
