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钐改性对锑化锡相变性能和相结构的影响。

Influence of samarium modification on the phase-change performance and phase structure of tin antimonide.

作者信息

Zhang Pei, Wu Weihua, Fu Bowen, Gu Han, Zhou Xiaochen, Zhu Xiaoqin

机构信息

School of Mathematics and Physics, Jiangsu University of Technology, Changzhou 213001, People's Republic of China.

National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People's Republic of China.

出版信息

Nanotechnology. 2023 Nov 7;35(4). doi: 10.1088/1361-6528/ad0485.

DOI:10.1088/1361-6528/ad0485
PMID:37852226
Abstract

This work presents the optimization of the crystallization behavior and reliability of SnSbthin films by doping Sm element. The phase transition behaviors induced by thermal were investigated byresistance measurement. With the addition of Sm element, SnSbfilm exhibits the superior crystallization temperature (232 °C) and data conservation (172.32 °C for 10 years), larger activation energy of crystallization (4.91 eV) and crystalline resistance (∼10Ω), which contributes to the increased thermal stability of the amorphous state and decrease in the programming energy. The Sm-doping can broaden the energy band gap from 0.55 to 1.07 eV. The amorphous Sm and Sn compositions could retard grain growth and refine grain size from 21.13 to 11.13 nm, combining with x-ray diffraction and x-ray photoelectron spectroscopy. The surface morphology of SnSbfilm becomes smoother after Sm doping as determined by atomic force microscopy images, resulting in the improved interfacial reliability. Phase change memory devices based on Sm(SnSb)films can successfully achieve the complete SET and RESET reversible operation process with high operating speed (200 ns) and low power consumption (1.6 × 10J). The results suggest that doping the proper concentration of Sm element will be an effectual solution to adapt and optimize the crystallization properties of SnSbphase change material.

摘要

这项工作展示了通过掺杂钐元素来优化SnSb薄膜的结晶行为和可靠性。通过电阻测量研究了热诱导的相变行为。随着钐元素的加入,SnSb薄膜表现出优异的结晶温度(232℃)和数据保存温度(172.32℃,持续10年)、更大的结晶活化能(4.91eV)和结晶电阻(约10Ω),这有助于提高非晶态的热稳定性并降低编程能量。钐掺杂可使能带隙从0.55eV拓宽至1.07eV。结合X射线衍射和X射线光电子能谱分析可知,非晶态的钐和锡成分可抑制晶粒生长并将晶粒尺寸从21.13nm细化至11.13nm。通过原子力显微镜图像测定,Sm掺杂后SnSb薄膜的表面形貌变得更光滑,从而提高了界面可靠性。基于Sm(SnSb)薄膜的相变存储器件能够以高运行速度(200ns)和低功耗(1.6×10J)成功实现完整的SET和RESET可逆操作过程。结果表明,掺杂适当浓度的钐元素将是一种有效解决方案,可用于适应和优化SnSb相变材料的结晶特性。

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