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口腔潜在恶性疾病治疗后采用 445nm 半导体激光愈合:一项随机临床试验。

Wound healing after therapy of oral potentially malignant disorders with a 445-nm semiconductor laser: a randomized clinical trial.

机构信息

Department of Oral and Craniomaxillofacial Surgery, UKGM GmbH, University Hospital Marburg, Giessen/Marburg, Germany.

Faculty of Medicine, Philipps-University, Marburg, 35043, Marburg, Germany.

出版信息

Clin Oral Investig. 2023 Dec 26;28(1):26. doi: 10.1007/s00784-023-05438-9.

Abstract

OBJECTIVES

Oral potentially malignant disorders (OPMDs) are the most clinically relevant precursor lesions of the oral squamous cell carcinoma (OSCC). OSCC is one of the 15 most common cancers worldwide. OSCC is with its high rate of mortality an important cause of death worldwide. The diagnosis and therapy of clinically relevant precursor lesions of the OSCC is one of the main parts of prevention of this malignant disease. Targeted therapy is one of the main challenges concerning an oncologically safe tissue removal without overwhelming functional and aesthetic impairment.

MATERIALS AND METHODS

In this randomized controlled trial, a newly introduced intraoral 445-nm semiconductor laser (2W; cw-mode; SIROLaser Blue, Dentsply Sirona, Bensheim, Germany) was used in the therapy of OPMDs. Duration and course of wound healing, pain, and scar tissue formation were compared to classical cold blade removal with primary suture by measuring remaining wound area, tissue colorimetry, and visual analogue scale. The study includes 40 patients randomized using a random spreadsheet sequence in two groups (n1 = 20; n2 = 20).

RESULTS

This comparative analysis revealed a significantly reduced remaining wound area after 1, 2, and 4 weeks in the laser group compared to the cold blade group (p < 0.05). In the laser group, a significantly reduced postoperative pain after 1 week was measured (p < 0.05).

CONCLUSION

Laser coagulation of OPMDs with the investigated 445-nm semiconductor laser is a safe, gentle, and predictable surgical procedure with beneficial wound healing and reduced postoperative discomfort.

CLINICAL RELEVANCE

Compared to the more invasive and bloody cold blade removal with scalpel, the 445-nm semiconductor laser could be a new functional less traumatic tool in the therapy of OPMDs. The method should be further investigated with regard to the identification of further possible indications.

TRAIL REGISTRATION

German Clinical Trials Register No: DRKS00032626.

摘要

目的

口腔潜在恶性疾病(OPMD)是口腔鳞状细胞癌(OSCC)最具临床相关性的前体病变。OSCC 是全球最常见的 15 种癌症之一。OSCC 死亡率高,是全球死亡的重要原因。诊断和治疗 OSCC 的临床相关前体病变是预防这种恶性疾病的主要部分之一。靶向治疗是在不造成功能和美观严重损害的情况下安全去除肿瘤组织的主要挑战之一。

材料和方法

在这项随机对照试验中,一种新引入的口腔内 445nm 半导体激光(2W;连续波模式;SIROLaser Blue,Dentsply Sirona,德国本斯海姆)用于 OPMD 的治疗。通过测量剩余伤口面积、组织比色和视觉模拟量表,比较了激光治疗与传统冷刀切除加一期缝合的愈合时间、愈合过程、疼痛和瘢痕形成。该研究纳入了 40 名患者,采用随机数表法将其随机分为两组(n1=20;n2=20)。

结果

这项对比分析显示,激光组在第 1、2 和 4 周时的剩余伤口面积明显小于冷刀组(p<0.05)。激光组术后第 1 周的疼痛明显减轻(p<0.05)。

结论

用研究中 445nm 半导体激光对 OPMD 进行激光凝固是一种安全、温和、可预测的手术,具有良好的伤口愈合和减轻术后不适的效果。

临床意义

与更具侵入性和出血性的冷刀切除术相比,445nm 半导体激光可能成为 OPMD 治疗的一种新的、功能上更少创伤的工具。应进一步研究该方法,以确定其是否有其他可能的适应证。

临床试验注册

德国临床试验注册处编号:DRKS00032626。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/b9ae/10751250/325dfcdf9cdf/784_2023_5438_Fig1_HTML.jpg

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