Ioannou Ioanna, Ioannou Panagiotis S, Kyratsi Theodora, Giapintzakis John
Department of Mechanical and Manufacturing Engineering, University of Cyprus, Nicosia 2901, Cyprus.
Materials (Basel). 2024 Jan 8;17(2):318. doi: 10.3390/ma17020318.
P-type BiSbTe polycrystalline pellets were fabricated using different methods: melting and mechanical alloying, followed by hot-press sintering. The effect of starting powder particle size on the thermoelectric properties was investigated in samples prepared using powders of different particle sizes (with micro- and/or nano-scale dimensions). A peak (350 K) of 1.13 was recorded for hot-pressed samples prepared from mechanical alloyed powder. Moreover, hot-pressed samples prepared from ≤45 μm powder exhibited similar (1.1). These high values are attributed both to the presence of high-density grain boundaries, which reduced the lattice thermal conductivity, as well as the formation of antisite defects during milling and grinding, which resulted in lower carrier concentrations and higher Seebeck coefficient values. In addition, BiSbTe bulk nanocomposites were fabricated in an attempt to further reduce the lattice thermal conductivity. Surprisingly, however, the lattice thermal conductivity showed an unexpected increasing trend in nanocomposite samples. This surprising observation can be attributed to a possible overestimation of the lattice thermal conductivity component by using the conventional Wiedemann-Franz law to estimate the electronic thermal conductivity component, which is known to occur in nanocomposite materials with significant grain boundary electrical resistance.
采用不同方法制备了P型BiSbTe多晶颗粒:熔融法和机械合金化法,随后进行热压烧结。在使用不同粒径(微米和/或纳米级尺寸)粉末制备的样品中,研究了起始粉末粒径对热电性能的影响。由机械合金化粉末制备的热压样品记录到1.13的峰值(350 K)。此外,由≤45μm粉末制备的热压样品表现出相似的峰值(1.1)。这些高峰值既归因于高密度晶界的存在,其降低了晶格热导率,也归因于在研磨和粉碎过程中反位缺陷的形成,这导致了较低的载流子浓度和较高的塞贝克系数值。此外,制备了BiSbTe块状纳米复合材料,试图进一步降低晶格热导率。然而,令人惊讶的是,纳米复合材料样品中的晶格热导率呈现出意外的上升趋势。这一惊人的观察结果可归因于使用传统的维德曼-弗兰兹定律来估计电子热导率分量时,可能高估了晶格热导率分量,已知这种情况会发生在具有显著晶界电阻的纳米复合材料中。