Barzdenas Vaidotas, Vasjanov Aleksandr
Department of Computer Science and Communications Technologies, Vilnius Gediminas Technical University, 10105 Vilnius, Lithuania.
Sensors (Basel). 2024 Jan 21;24(2):675. doi: 10.3390/s24020675.
Modern wireless communication systems are of utmost importance to various sectors such as healthcare, education, the household, and the advancement of emerging technologies like the internet of things, autonomous vehicles, and the enhancement of 5G. Further development and improvement of these systems drives the need for small dimension, high integration and density, and cost-effective electronic devices. Achieving optimal performance in wireless electronic devices involves overcoming engineering challenges related to microstrip line signal integrity. This research addresses the impact of surface mount technology (SMT) component pads on signal integrity, proposing a novel high-frequency microstrip line structure for mitigating impedance discontinuities. The study introduces stepped microstrip lines and explores characteristic impedance compensation techniques. A six-layer printed circuit board (PCB) structure is presented, and the effects of compensation on signal integrity are analyzed using time-domain reflectometry and scattering parameter measurements. The results demonstrate the effectiveness of compensation methods in aligning characteristic impedance with desired values, thereby ensuring improved impedance matching and transmission coefficients. The average over-the-length impedance for the proposed structure with compensation applied was measured to be 52.7 Ω, which is only 1.3 Ω (2.5%) more than that of the reference microstrip. Applying reference plane cut-outs leads to a maximum compensated absolute value of more than 30 Ω to reach the target impedance with a 10% tolerance. This research contributes valuable insights for advancing wireless communication systems and maintaining robustness in high-frequency microstrip transmission lines.
现代无线通信系统对医疗保健、教育、家庭等各个领域以及物联网、自动驾驶车辆等新兴技术的发展和5G的增强至关重要。这些系统的进一步发展和改进推动了对小尺寸、高集成度和密度以及具有成本效益的电子设备的需求。在无线电子设备中实现最佳性能涉及克服与微带线信号完整性相关的工程挑战。本研究探讨了表面贴装技术（SMT）元件焊盘对信号完整性的影响，提出了一种用于减轻阻抗不连续性的新型高频微带线结构。该研究引入了阶梯式微带线并探索了特征阻抗补偿技术。提出了一种六层印刷电路板（PCB）结构，并使用时域反射仪和散射参数测量分析了补偿对信号完整性的影响。结果表明，补偿方法在使特征阻抗与期望值对齐方面是有效的，从而确保了改进的阻抗匹配和传输系数。应用补偿后的所提出结构的平均全长阻抗测量值为52.7Ω，仅比参考微带线高1.3Ω（2.5%）。应用参考平面切口可导致最大补偿绝对值超过30Ω，以在10%的容差范围内达到目标阻抗。这项研究为推进无线通信系统和保持高频微带传输线的稳健性提供了有价值的见解。
