Yan Yinjia, Han Miao, Jiang Yixue, Ng Evelyn Ling Ling, Zhang Yanni, Owh Cally, Song Qing, Li Peng, Loh Xian Jun, Chan Benjamin Qi Yu, Chan Siew Yin
Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China.
Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore.
ACS Appl Mater Interfaces. 2024 Feb 7;16(5):5337-5354. doi: 10.1021/acsami.3c13258. Epub 2024 Jan 29.
The use of electrically conductive polymers (CPs) in the development of electronic devices has attracted significant interest due to their unique intrinsic properties, which result from the synergistic combination of physicochemical properties in conventional polymers with the electronic properties of metals or semiconductors. Most conventional methods adopted for the fabrication of devices with nonplanar morphologies are still challenged by the poor ionic/electronic mobility of end products. Additive manufacturing (AM) brings about exciting prospects to the realm of CPs by enabling greater design freedom, more elaborate structures, quicker prototyping, relatively low cost, and more environmentally friendly electronic device creation. A growing variety of AM technologies are becoming available for three-dimensional (3D) printing of conductive devices, i.e., vat photopolymerization (VP), material extrusion (ME), powder bed fusion (PBF), material jetting (MJ), and lamination object manufacturing (LOM). In this review, we provide an overview of the recent research progress in the area of CPs developed for AM, which advances the design and development of future electronic devices. We consider different AM techniques, vis-à-vis, their development progress and respective challenges in printing CPs. We also discuss the material requirements and notable advances in 3D printing of CPs, as well as their potential electronic applications including wearable electronics, sensors, energy storage and conversion devices, etc. This review concludes with an outlook on AM of CPs.
由于其独特的固有特性,导电聚合物(CPs)在电子器件开发中的应用引起了广泛关注。这些特性源于传统聚合物的物理化学性质与金属或半导体的电子性质的协同结合。大多数用于制造具有非平面形态器件的传统方法仍然面临最终产品离子/电子迁移率低的挑战。增材制造(AM)通过提供更大的设计自由度、更精细的结构、更快的原型制作、相对较低的成本以及更环保的电子器件制造方式,为CPs领域带来了令人兴奋的前景。越来越多的增材制造技术可用于导电器件的三维(3D)打印,即光固化成型(VP)、材料挤出(ME)、粉末床熔融(PBF)、材料喷射(MJ)和分层实体制造(LOM)。在本综述中,我们概述了为增材制造开发的CPs领域的最新研究进展,这推动了未来电子器件的设计和开发。我们考虑了不同的增材制造技术,以及它们在打印CPs方面的发展进展和各自面临的挑战。我们还讨论了CPs的3D打印的材料要求和显著进展,以及它们潜在的电子应用,包括可穿戴电子产品、传感器、能量存储和转换设备等。本综述最后对CPs的增材制造进行了展望。