Postek Michael T
National Institute of Standards and Technology, Gaithersburg, MD 20899-0001.
J Res Natl Inst Stand Technol. 1994 Sep-Oct;99(5):641-671. doi: 10.6028/jres.099.059.
During the manufacturing of present-day integrated circuits, certain measurements must be made of the submicrometer structures composing the device with a high degree of repeatability. Optical microscopy, scanning electron microscopy, and the various forms of scanning probe microscopies are major microscopical techniques used for this submicrometer metrology. New techniques applied to scanning electron microscopy have improved some of the limitations of this technique and time will permit even further improvements. This paper reviews the current state of scanning electron microscope (SEM) metrology in light of many of these recent improvements.
在当今集成电路制造过程中,必须对构成器件的亚微米结构进行某些具有高度重复性的测量。光学显微镜、扫描电子显微镜以及各种形式的扫描探针显微镜是用于这种亚微米计量的主要显微技术。应用于扫描电子显微镜的新技术改善了该技术的一些局限性,并且随着时间的推移还会有进一步的改进。本文鉴于最近的诸多改进,综述了扫描电子显微镜(SEM)计量的当前状况。