Li Chen, Mu Xiaoke, Korytov Maxim, Alexandrou Ioannis, Bosch Eric G T
Thermo Fisher Scientific, Eindhoven, the Netherlands.
IMEC, Leuven, Belgium.
J Microsc. 2024 Mar;293(3):177-188. doi: 10.1111/jmi.13271. Epub 2024 Feb 14.
DPC in Scanning Transmission Electron Microscopy (STEM) is a valuable method for mapping the electric fields in semiconductor materials. However, optimising the experimental conditions can be challenging. In this paper, we test and compare critical experimental parameters, including the convergence angle, camera length, acceleration voltage, sample configuration, and orientation using a four-quadrant segmented detector and a Si specimen containing layers of different As concentrations. The DPC measurements show a roughly linear correlation with the estimated electric fields, until the field gets close to the detection limitation, which is ∼0.5 mV/nm with a sample thickness of ∼145 nm. These results can help inform which technique to use for different user cases: When the electric field at a planar junction is above ∼0.5 mV/nm, DPC with a segmented detector is practical for electric field mapping. With a planar junction, the DPC signal-to-noise ratio can be increased by increasing the specimen thickness. However, for semiconductor devices with electric fields smaller than ∼0.5 mV/nm, or for devices containing curved junctions, DPC is unreliable and techniques with higher sensitivity will need to be explored, such as 4D STEM using a pixelated detector.
扫描透射电子显微镜(STEM)中的差分相位衬度(DPC)是绘制半导体材料中电场的一种有价值的方法。然而,优化实验条件可能具有挑战性。在本文中,我们使用四象限分段探测器和包含不同砷浓度层的硅样品,测试并比较了关键实验参数,包括会聚角、相机长度、加速电压、样品配置和取向。DPC测量结果与估计电场大致呈线性相关,直到电场接近检测极限,对于厚度约为145nm的样品,检测极限约为0.5mV/nm。这些结果有助于为不同应用场景选择合适的技术:当平面结处的电场高于约0.5mV/nm时,使用分段探测器的DPC适用于电场映射。对于平面结,通过增加样品厚度可以提高DPC的信噪比。然而,对于电场小于约0.5mV/nm的半导体器件,或对于包含弯曲结的器件,DPC不可靠,需要探索更高灵敏度的技术,如使用像素化探测器的4D STEM。