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用于可拉伸电子器件的机械和热引导的蜂窝状纳米复合材料,具有应变不敏感的高导热性

Mechanically and Thermally Guided, Honeycomb-like Nanocomposites with Strain-Insensitive High Thermal Conductivity for Stretchable Electronics.

作者信息

Liang Yahui, Zhao Nifang, Gao Weiwei, Bai Hao

机构信息

State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou 310027, China.

Institute of Zhejiang University-Quzhou, Quzhou 324000, China.

出版信息

ACS Nano. 2024 Mar 19;18(11):8199-8208. doi: 10.1021/acsnano.3c12233. Epub 2024 Mar 8.

DOI:10.1021/acsnano.3c12233
PMID:38457331
Abstract

Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m K) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.

摘要

热管理材料对于可拉伸电子设备和系统而言变得愈发关键。与应用于静态条件的传统导热材料截然不同,可拉伸电子设备的热管理材料还需要应变不敏感的热导率,因为它们通常会经历循环变形。然而,实现这样的特性仍然具有挑战性,主要是因为传统的导热聚合物复合材料普遍缺乏机械导向设计。在此,我们报道了一种具有三维(3D)导热网络的蜂窝状纳米复合材料,它是通过阵列式冰模板技术制备,随后进行弹性体渗透而成。具有薄而致密壁(约40μm)的六边形蜂窝状结构赋予我们的复合材料在超低氮化硼纳米片(BNNS)负载量(约0.85体积%)下具有高的面内热导率(约1.54W m⁻¹ K⁻¹),热导率增强因子高达820%,热不敏感应变高达200%,这分别比文献报道的值高2.7倍和2倍。我们报道了一种用于开发高性能可拉伸电子设备的先进热管理材料的智能策略。

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