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用于陶瓷-铜基板飞刀切割的机床设计与研究

Design and Study of Machine Tools for the Fly-Cutting of Ceramic-Copper Substrates.

作者信息

Zhang Chupeng, Sun Jiazheng, Zhou Jia, Chen Xiao

机构信息

School of Mechanical Engineering, Hubei University of Technology, Wuhan 430068, China.

出版信息

Materials (Basel). 2024 Feb 28;17(5):1111. doi: 10.3390/ma17051111.

DOI:10.3390/ma17051111
PMID:38473583
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10935192/
Abstract

Ceramic-copper substrates, as high-power, load-bearing components, are widely used in new energy vehicles, electric locomotives, high-energy lasers, integrated circuits, and other fields. The service length will depend on the substrate's copper-coated surface quality, which frequently achieved by utilising an abrasive strip polishing procedure on the substrate's copper-coated surface. Precision diamond fly-cutting processing machine tools were made because of the low processing accuracy and inability to match the production line's efficiency. An analysis of the fly-cutting machining principle and the structural makeup of the ceramic-copper substrate is the first step in creating a roughness prediction model based on a tool tip trajectory. This model demonstrates that a shift in the tool tip trajectory due to spindle runout error directly impacts the machined surface's roughness. The device's structural optimisation design is derived from the above analyses and implemented using finite element software. Modal and harmonic response analysis validated the machine's gantry symmetrical structural layout, a parametric variable optimisation design optimised the machine tool's overall dimensions, and simulation validated the fly-cutterring's constituent parts. Enhancing the machine tool's stability and motion accuracy requires using the LK-G5000 laser sensor to measure the guideway's straightness. The result verified the machine tool's design index, with the Z- and Y-axes' straightness being better than 2.42 μm/800 mm and 2.32 μm/200 mm, respectively. Ultimately, the device's machining accuracy was confirmed. Experiments with flying-cut machining on a 190 × 140 mm ceramic-copper substrate yielded a roughness of Sa9.058 nm. According to the experimental results, the developed machine tool can fulfil the design specifications.

摘要

陶瓷 - 铜基板作为高功率、承重部件,广泛应用于新能源汽车、电力机车、高能激光、集成电路等领域。其使用寿命取决于基板镀铜表面的质量,而这通常是通过对基板镀铜表面采用砂带抛光工艺来实现的。由于加工精度低且无法匹配生产线效率,因此制造了精密金刚石飞切加工机床。基于刀尖轨迹创建粗糙度预测模型的第一步是分析飞切加工原理和陶瓷 - 铜基板的结构组成。该模型表明,由于主轴跳动误差导致的刀尖轨迹变化直接影响加工表面的粗糙度。基于上述分析得出该设备的结构优化设计,并使用有限元软件予以实现。模态和谐波响应分析验证了机床的龙门对称结构布局,参数变量优化设计优化了机床的整体尺寸,仿真验证了飞刀盘的组成部件。使用LK - G5000激光传感器测量导轨直线度对于提高机床的稳定性和运动精度是必要的。结果验证了机床的设计指标,Z轴和Y轴的直线度分别优于2.42μm/800mm和2.32μm/200mm。最终,确认了该设备的加工精度。在尺寸为190×140mm的陶瓷 - 铜基板上进行飞切加工实验,得到的粗糙度为Sa9.058nm。根据实验结果,所开发的机床能够满足设计规格要求。

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本文引用的文献

1
Effect of KDP-Crystal Material Properties on Surface Morphology in Ultra-Precision Fly Cutting.KDP晶体材料特性对超精密飞切表面形貌的影响
Micromachines (Basel). 2020 Aug 25;11(9):802. doi: 10.3390/mi11090802.
2
Next Generation Ceramic Substrate Fabricated at Room Temperature.室温下制造的下一代陶瓷基板。
Sci Rep. 2017 Jul 26;7(1):6637. doi: 10.1038/s41598-017-06774-z.