Park Bo-In, Kim Jekyung, Lu Kuangye, Zhang Xinyuan, Lee Sangho, Suh Jun Min, Kim Dong-Hwan, Kim Hyunseok, Kim Jeehwan
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Nano Lett. 2024 Mar 13;24(10):2939-2952. doi: 10.1021/acs.nanolett.3c04465. Epub 2024 Mar 4.
Advanced heterogeneous integration technologies are pivotal for next-generation electronics. Single-crystalline materials are one of the key building blocks for heterogeneous integration, although it is challenging to produce and integrate these materials. Remote epitaxy is recently introduced as a solution for growing single-crystalline thin films that can be exfoliated from host wafers and then transferred onto foreign platforms. This technology has quickly gained attention, as it can be applied to a wide variety of materials and can realize new functionalities and novel application platforms. Nevertheless, remote epitaxy is a delicate process, and thus, successful execution of remote epitaxy is often challenging. Here, we elucidate the mechanisms of remote epitaxy, summarize recent breakthroughs, and discuss the challenges and solutions in the remote epitaxy of various material systems. We also provide a vision for the future of remote epitaxy for studying fundamental materials science, as well as for functional applications.
先进的异质集成技术对下一代电子产品至关重要。单晶材料是异质集成的关键组成部分之一,尽管生产和集成这些材料具有挑战性。远程外延是最近引入的一种解决方案,用于生长可以从主晶圆上剥离然后转移到异质平台上的单晶薄膜。这项技术迅速受到关注,因为它可以应用于多种材料,并能实现新功能和新颖的应用平台。然而,远程外延是一个精细的过程,因此,成功执行远程外延往往具有挑战性。在这里,我们阐明了远程外延的机制,总结了最近的突破,并讨论了各种材料系统远程外延中的挑战和解决方案。我们还对远程外延在基础材料科学研究以及功能应用方面的未来发展提出了展望。