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构建钴卟啉修饰的氧化铜纳米线阵列作为串联电催化剂用于增强将一氧化碳还原为碳产物的反应

Construction of Cobalt Porphyrin-Modified CuO Nanowire Array as a Tandem Electrocatalyst for Enhanced CO Reduction to C Products.

作者信息

Min Shihao, Xu Xiao, He Jiaxin, Sun Miao, Lin Wenlie, Kang Longtian

机构信息

Key Laboratory of Design and Assembly of Functional Nanostructures, and Fujian Provincial Key Laboratory of Nanomaterials, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, Beijing, 100045, P. R. China.

Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350108, P. R. China.

出版信息

Small. 2024 Aug;20(32):e2400592. doi: 10.1002/smll.202400592. Epub 2024 Mar 19.

Abstract

Here, the molecule-modified Cu-based array is first constructed as the self-supporting tandem catalyst for electrocatalytic CO reduction reaction (CORR) to C products. The modification of cuprous oxide nanowire array on copper mesh (CuO@CM) with cobalt(II) tetraphenylporphyrin (CoTPP) molecules is achieved via a simple liquid phase method. The systematical characterizations confirm that the formation of axial coordinated Co-O-Cu bond between CuO and CoTPP can significantly promote the dispersion of CoTPP molecules on CuO and the electrical properties of CoTPP-CuO@CM heterojunction array. Consequently, as compared to CuO@CM array, the optimized CoTPP-CuO@CM sample as electrocatalyst can realize the 2.08-fold C Faraday efficiency (73.2% vs 35.2%) and the 2.54-fold current density (‒52.9 vs ‒20.8 mA cm) at ‒1.1 V versus RHE in an H-cell. The comprehensive performance is superior to most of the reported Cu-based materials in the H-cell. Further study reveals that the CoTPP adsorption on CuO can restrain the hydrogen evolution reaction, improve the coverage of CO intermediate, and maintain the existence of Cu(I) at low potential.

摘要

在此,首先构建分子修饰的铜基阵列作为用于电催化CO还原反应(CORR)生成C产物的自支撑串联催化剂。通过简单的液相法实现了用四苯基卟啉钴(II)(CoTPP)分子对铜网上的氧化亚铜纳米线阵列(CuO@CM)进行修饰。系统表征证实,CuO与CoTPP之间轴向配位的Co-O-Cu键的形成可显著促进CoTPP分子在CuO上的分散以及CoTPP-CuO@CM异质结阵列的电学性质。因此,与CuO@CM阵列相比,优化后的CoTPP-CuO@CM样品作为电催化剂在H型电解池中相对于可逆氢电极(RHE)在-1.1 V时可实现2.08倍的C法拉第效率(73.2%对35.2%)和2.54倍的电流密度(-52.9对-20.8 mA cm)。其综合性能优于H型电解池中大多数已报道的铜基材料。进一步研究表明,CoTPP在CuO上的吸附可抑制析氢反应,提高CO中间体的覆盖率,并在低电位下维持Cu(I)的存在。

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