Vande Ryse Ruben, Van Osta Michiel, Gruyaert Mounia, Oosterlinck Maarten, Kalácska Ádám, Edeleva Mariya, Pille Frederik, D'hooge Dagmar R, Cardon Ludwig, De Baets Patrick
Centre for Polymer and Material Technologies (CPMT), Department of Materials, Textiles and Chemical Engineering, Ghent University, Technologiepark-Zwijnaarde 130, 9052 Ghent, Belgium.
Internet Technology and Data Science Lab (IDLab), Department of Information Technology (INTEC), Ghent University-imec, Technologiepark-Zwijnaarde 126, 9052 Ghent, Belgium.
Nanomaterials (Basel). 2024 Mar 29;14(7):606. doi: 10.3390/nano14070606.
Polyamide 11 (PA11) and copolyester (TPC-E) were compounded through melt extrusion with low levels (below 10%) of expanded graphite (EG), aiming at the manufacturing of a thermally and electrically conductive composite resistant to friction and with acceptable mechanical properties. Thermal characterisation showed that the EG presence had no influence on the onset degradation temperature or melting temperature. While the specific density of the produced composite materials increased linearly with increasing levels of EG, the tensile modulus and flexural modulus showed a significant increase already at the introduction of 1 wt% EG. However, the elongation at break decreased significantly for higher loadings, which is typical for composite materials. We observed the increase in the dielectric and thermal conductivity, and the dissipated power displayed a much larger increase where high frequencies (e.g., 10 GHz) were taken into account. The tribological results showed significant changes at 4 wt% for the PA11 composite and 6 wt% for the TPC-E composite. Morphological analysis of the wear surfaces indicated that the main wear mechanism changed from abrasive wear to adhesive wear, which contributes to the enhanced wear resistance of the developed materials. Overall, we manufactured new composite materials with enhanced dielectric properties and superior wear resistance while maintaining good processability, specifically upon using 4-6 wt% of EG.
聚酰胺11(PA11)和共聚酯(TPC-E)通过熔体挤出与低含量(低于10%)的膨胀石墨(EG)进行复合,旨在制造一种具有抗摩擦性能且机械性能可接受的导热和导电复合材料。热表征表明,EG的存在对起始降解温度或熔点没有影响。虽然所制备复合材料的比重随EG含量的增加呈线性增加,但在引入1 wt% EG时,拉伸模量和弯曲模量就已显著增加。然而,对于更高的负载量,断裂伸长率显著下降,这是复合材料的典型特征。我们观察到介电导率和热导率增加,并且在考虑高频(例如10 GHz)时,耗散功率有更大的增加。摩擦学结果表明,PA11复合材料在4 wt%时以及TPC-E复合材料在6 wt%时出现显著变化。磨损表面的形态分析表明,主要磨损机制从磨粒磨损转变为粘着磨损,这有助于提高所开发材料的耐磨性。总体而言,我们制造出了具有增强介电性能和优异耐磨性且保持良好加工性能的新型复合材料,特别是在使用4 - 6 wt% EG时。