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具有高弛豫铁电聚合物栅极绝缘体的可溶液加工低压碳纳米管场效应晶体管。

Solution-processable low-voltage carbon nanotube field-effect transistors with high-relaxor ferroelectric polymer gate insulator.

作者信息

Yang Dongseong, Moon Yina, Han Nara, Lee Minwoo, Beak Jeongwoo, Lee Seung-Hoon, Kim Dong-Yu

机构信息

School of Materials Science and Engineering, Gwangju Institute of Science and Technology, 123 Cheomdangwagi-ro, Buk-gu, Gwangju 61005, Republic of Korea.

Chemical Materials Solutions Center, Korea Research Institute of Chemical Technology (KRICT), 141 Gajeong-ro, Yuseong-gu, Daejeon 34114, Republic of Korea.

出版信息

Nanotechnology. 2024 May 1;35(29). doi: 10.1088/1361-6528/ad3e01.

DOI:10.1088/1361-6528/ad3e01
PMID:38608317
Abstract

Achieving energy-efficient and high-performance field-effect transistors (FETs) is one of the most important goals for future electronic devices. This paper reports semiconducting single-walled carbon nanotube FETs (s-SWNT-FETs) with an optimized high-relaxor ferroelectric insulator P(VDF-TrFE-CFE) thickness for low-voltage operation. The s-SWNT-FETs with an optimized thickness (∼800 nm) of the high-insulator exhibited the highest average mobility of 14.4 cmVsat the drain voltage () of 1 V, with a high current on/off ratio (>10). The optimized device performance resulted from the suppressed gate leakage current () and a sufficiently large capacitance (>50 nF cm) of the insulating layer. Despite the extremely high capacitance (>100 nF cm) of the insulating layer, an insufficient thickness (<450 nm) induces a high, leading to reducedand mobility of s-SWNT-FETs. Conversely, an overly thick insulator (>1200 nm) cannot introduce sufficient capacitance, resulting in limited device performance. The large capacitance and sufficient breakdown voltage of the insulating layer with an appropriate thickness significantly improved p-type performance. However, a reduced n-type performance was observed owing to the increased electron trap density caused by fluorine proportional to the insulator thickness. Hence, precise control of the insulator thickness is crucial for achieving low-voltage operation with enhanced s-SWNT-FET performance.

摘要

实现节能且高性能的场效应晶体管(FET)是未来电子设备最重要的目标之一。本文报道了具有优化的高弛豫铁电绝缘体P(VDF-TrFE-CFE)厚度以实现低电压操作的半导体单壁碳纳米管FET(s-SWNT-FET)。具有优化厚度(约800 nm)的高绝缘体的s-SWNT-FET在漏极电压()为1 V时表现出最高平均迁移率14.4 cmV,开/关电流比高(>10)。优化的器件性能源于抑制的栅极漏电流()和绝缘层足够大的电容(>50 nF/cm)。尽管绝缘层电容极高(>100 nF/cm),但厚度不足(<450 nm)会导致高,从而降低s-SWNT-FET的和迁移率。相反,过厚的绝缘体(>1200 nm)无法引入足够的电容,导致器件性能受限。具有适当厚度的绝缘层的大电容和足够的击穿电压显著改善了p型性能。然而,由于与绝缘体厚度成比例的氟导致电子陷阱密度增加,观察到n型性能下降。因此,精确控制绝缘体厚度对于实现具有增强的s-SWNT-FET性能的低电压操作至关重要。

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引用本文的文献

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Polymer Dielectric-Based Emerging Devices: Advancements in Memory, Field-Effect Transistor, and Nanogenerator Technologies.基于聚合物电介质的新兴器件:存储器、场效应晶体管和纳米发电机技术的进展
Micromachines (Basel). 2024 Aug 31;15(9):1115. doi: 10.3390/mi15091115.