Choi Wangmyung, Choi Junhwan, Han Yongbin, Yoo Hocheon, Yoon Hong-Joon
Department of Semiconductor Engineering, Gachon University, Seongnam 13120, Republic of Korea.
Department of Chemical Engineering, Dankook University, Yongin 16890, Republic of Korea.
Micromachines (Basel). 2024 Aug 31;15(9):1115. doi: 10.3390/mi15091115.
Polymer dielectric materials have recently attracted attention for their versatile applications in emerging electronic devices such as memory, field-effect transistors (FETs), and triboelectric nanogenerators (TENGs). This review highlights the advances in polymer dielectric materials and their integration into these devices, emphasizing their unique electrical, mechanical, and thermal properties that enable high performance and flexibility. By exploring their roles in self-sustaining technologies (e.g., artificial intelligence (AI) and Internet of Everything (IoE)), this review emphasizes the importance of polymer dielectric materials in enabling low-power, flexible, and sustainable electronic devices. The discussion covers design strategies to improve the dielectric constant, charge trapping, and overall device stability. Specific challenges, such as optimizing electrical properties, ensuring process scalability, and enhancing environmental stability, are also addressed. In addition, the review explores the synergistic integration of memory devices, FETs, and TENGs, focusing on their potential in flexible and wearable electronics, self-powered systems, and sustainable technologies. This review provides a comprehensive overview of the current state and prospects of polymer dielectric-based devices in advanced electronic applications by examining recent research breakthroughs and identifying future opportunities.
聚合物介电材料最近因其在新兴电子器件(如存储器、场效应晶体管(FET)和摩擦电纳米发电机(TENG))中的广泛应用而受到关注。本综述重点介绍了聚合物介电材料的进展及其在这些器件中的集成,强调了它们独特的电学、机械和热性能,这些性能能够实现高性能和灵活性。通过探讨它们在自我维持技术(如人工智能(AI)和万物互联(IoE))中的作用,本综述强调了聚合物介电材料在实现低功耗、柔性和可持续电子器件方面的重要性。讨论内容涵盖了提高介电常数、电荷俘获和整体器件稳定性的设计策略。还讨论了具体挑战,如优化电学性能、确保工艺可扩展性和提高环境稳定性。此外,本综述探讨了存储器器件、FET和TENG的协同集成,重点关注它们在柔性和可穿戴电子、自供电系统及可持续技术方面的潜力。通过审视近期的研究突破并确定未来机遇,本综述全面概述了基于聚合物介电的器件在先进电子应用中的现状和前景。