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用于高介电常数和低损耗铁电聚合物复合薄膜的自组装MXene@氟石墨烯杂化物

Self-Assembled MXene@Fluorographene Hybrid for High Dielectric Constant and Low Loss Ferroelectric Polymer Composite Films.

作者信息

Wang Guolong, Yang Zhuofan, Li Leyuan, Ren Junwen, Liu Jiamei, Li Lei

机构信息

State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, China.

College of Electrical Engineering, Sichuan University, Chengdu 610065, China.

出版信息

ACS Appl Mater Interfaces. 2024 May 15;16(19):25268-25279. doi: 10.1021/acsami.4c01607. Epub 2024 May 1.

Abstract

Modern electrical applications urgently need flexible polymer films with a high dielectric constant (ε) and low loss. Recently, the MXene-filled percolative composite has emerged as a potential material choice because of the promised high ε. Nevertheless, the typically accompanied high dielectric loss hinders its applications. Herein, a facile and effective surface modification strategy of cladding TiCT MXene (T = F or O; FMX) with fluorographene (FG) via self-assembly is proposed. The obtained FMX@FG hybrid yields high ε (up to 108 @1 kHz) and low loss (loss tangent tan δ = 1.16 @ 1 kHz) in a ferroelectric polymer composite at a low loading level (the equivalent of 1.5 wt % FMX), which is superior to its counterparts in our work (e.g., FMX: ε = 104, tan δ = 10.71) and other studies. It is found that the FG layer outside FMX plays a critical role in both the high dielectric constant and low loss from experimental characterizations and finite element simulations. For one thing, FG with a high F/C ratio would induce a favorable structure of high β-phase crystallinity, extensive microcapacitor networks, and abundant interfacial dipoles in polymer composites that account for the high ε. For another, FG, as a highly insulating layer, can inhibit the formation of conductive networks and inter-FMX electron tunneling, which is responsible for conduction loss. The results demonstrate the potential of a self-assembled FMX@FG hybrid for high ε and low loss polymer composite films and offer a new strategy for designing advanced polymer composite dielectrics.

摘要

现代电气应用迫切需要具有高介电常数(ε)和低损耗的柔性聚合物薄膜。最近,填充MXene的渗流复合材料因其有望具有高ε而成为一种潜在的材料选择。然而,通常伴随的高介电损耗阻碍了其应用。在此,提出了一种通过自组装用氟石墨烯(FG)包覆TiCT MXene(T = F或O;FMX)的简便有效的表面改性策略。在低负载水平(相当于1.5 wt% FMX)下,所得的FMX@FG杂化物在铁电聚合物复合材料中产生高ε(在1 kHz时高达108)和低损耗(损耗角正切tan δ = 1.16 @ 1 kHz),这优于我们工作中的同类材料(例如,FMX:ε = 104,tan δ = 10.71)以及其他研究中的材料。从实验表征和有限元模拟发现,FMX外部的FG层在高介电常数和低损耗方面都起着关键作用。一方面,具有高F/C比的FG会在聚合物复合材料中诱导出有利于高β相结晶度、广泛的微电容器网络和丰富界面偶极子的结构,这解释了高ε的原因。另一方面,FG作为高度绝缘层,可以抑制导电网络的形成和FMX间电子隧穿,这是传导损耗的原因。结果证明了自组装FMX@FG杂化物在高ε和低损耗聚合物复合薄膜方面的潜力,并为设计先进的聚合物复合电介质提供了一种新策略。

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