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通过控制薄片尺寸和表面端基来提高TiCT MXene/聚合物复合材料的介电常数

Enhancement of Dielectric Permittivity of TiCT MXene/Polymer Composites by Controlling Flake Size and Surface Termination.

作者信息

Tu Shaobo, Jiang Qiu, Zhang Junwei, He Xin, Hedhili Mohamed Nejib, Zhang Xixiang, Alshareef Husam N

机构信息

Materials Science and Engineering, Physical Science and Engineering Division , King Abdullah University of Science and Technology (KAUST) , Thuwal 23955-6900 , Saudi Arabia.

出版信息

ACS Appl Mater Interfaces. 2019 Jul 31;11(30):27358-27362. doi: 10.1021/acsami.9b09137. Epub 2019 Jul 15.

Abstract

We report a strong effect of the MXene flake size and surface termination on the dielectric permittivity of MXene polymer composites. Specifically, poly(vinylidene fluoride-trifluoro-ethylene-chlorofluoroehylene) or P(VDF-TrFE-CFE) polymer embedded with large (ca. 4.5 μm) TiCT flakes achieves a dielectric permittivity as high as 10 near the percolation limit of 15.3 wt % MXene loading. In comparison, the dielectric permittivity of MXene/P(VDF-TrFE-CFE) using small (ca. 1.5 μm) TiCT flakes (S-MXene) achieves a dielectric permittivity of 10 near the percolation limit of 16.8 wt %. Meanwhile, increasing the concentration of surface functional groups on the MXene surface (-O, -F, and -OH) by extending the etching time gives a dielectric constant of 2204 near the percolation limit of 15.7 wt %. The ratio of permittivity to the loss factor of our large flake composite is superior to that of the small flake composite, and to all previously reported carbon-based fillers in P(VDF-TrFE-CFE). We show that the dielectric permittivity enhancement is strongly related to the charge accumulation at the surfaces between the two dimensional (2D) MXene flakes and the polymer matrix under an external applied electric field.

摘要

我们报道了MXene薄片尺寸和表面端基对MXene聚合物复合材料介电常数的显著影响。具体而言,嵌入大尺寸(约4.5μm)TiCT薄片的聚(偏二氟乙烯-三氟乙烯-氯氟乙烯)即P(VDF-TrFE-CFE)聚合物,在MXene负载量为15.3 wt%的渗流极限附近,介电常数高达10。相比之下,使用小尺寸(约1.5μm)TiCT薄片(S-MXene)的MXene/P(VDF-TrFE-CFE)在16.8 wt%的渗流极限附近,介电常数达到10。同时,通过延长蚀刻时间增加MXene表面(-O、-F和-OH)的表面官能团浓度,在15.7 wt%的渗流极限附近,介电常数达到2204。我们的大尺寸薄片复合材料的介电常数与损耗因子之比优于小尺寸薄片复合材料,也优于之前报道的所有P(VDF-TrFE-CFE)基碳基填料。我们表明,介电常数的增强与二维(2D)MXene薄片和聚合物基体之间的表面在外部施加电场下的电荷积累密切相关。

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