Yu Qian, Yang Zhen, Peng Lijun, Xie Haofeng, Cao Yicheng, Zhu Yunqing, Liu Feng
State Key Laboratory of Nonferrous Metals and Processes, GRIMN Group Co., Ltd., Beijing 100088, China.
GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China.
Materials (Basel). 2024 Apr 25;17(9):2015. doi: 10.3390/ma17092015.
Thermal deformation behavior of Cu-Cr-Sn alloy ingots under deformation temperatures ranging from 600 °C to 950 °C and strain rates from 0.01 s to 10 s was investigated in detail. The thermal deformation constitutive equation and thermal processing map of the alloy were established, respectively. The activation energy Q was determined as 430.61 KJ/mol. The optimal deformation system corresponding to the hot working diagram was a deformation temperature of 900 °C and strain rate of 0.1 s. Under these deformation conditions, twin dynamic recrystallization (TDRX), continuous dynamic recrystallization (CDRX), and discontinuous dynamic recrystallization (DDRX) occurred simultaneously, with the twinning process causing the stress-strain curve to exhibit a wavy change. The thermal deformation microstructure of the alloy is co-regulated by different recrystallization mechanisms, with DDRX occurring mainly at low deformation temperatures, and both CDRX and DDRX occurring at high deformation temperatures.
详细研究了Cu-Cr-Sn合金铸锭在600℃至950℃的变形温度和0.01s至10s的应变速率下的热变形行为。分别建立了该合金的热变形本构方程和热加工图。确定激活能Q为430.61kJ/mol。对应于热加工图的最佳变形制度为变形温度900℃和应变速率0.1s。在这些变形条件下,孪生动态再结晶(TDRX)、连续动态再结晶(CDRX)和不连续动态再结晶(DDRX)同时发生,孪生过程使应力-应变曲线呈现波浪形变化。合金的热变形微观组织由不同的再结晶机制共同调控,DDRX主要发生在低变形温度下,而CDRX和DDRX在高变形温度下均会发生。