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烤瓷熔附钯银合金的热应力破坏

Thermal stress failure of porcelain bonded to a palladium-silver alloy.

作者信息

Walton T R, O'Brien W J

出版信息

J Dent Res. 1985 Mar;64(3):476-80. doi: 10.1177/00220345850640031801.

DOI:10.1177/00220345850640031801
PMID:3882796
Abstract

Cracking or rupturing, due to thermal stress, of porcelain bonded to a palladium-silver alloy indicated that porcelain-metal thermal compatibility was dependent on: the difference in thermal expansion coefficients of the porcelain and metal; the geometry and dimensions of the samples; and the porcelain-metal thickness ratio. A spherical configuration was more sensitive to thermal expansion coefficient differences than was a disc configuration. A higher incidence of cracking resulted from an increase in both specimen size and porcelain-metal thickness ratio.

摘要

由于热应力导致的与钯银合金结合的瓷层出现裂纹或破裂表明,瓷-金属热相容性取决于:瓷和金属的热膨胀系数差异;样品的几何形状和尺寸;以及瓷-金属厚度比。球形结构比盘形结构对热膨胀系数差异更敏感。样品尺寸和瓷-金属厚度比的增加都会导致更高的裂纹发生率。

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Thermal stress failure of porcelain bonded to a palladium-silver alloy.烤瓷熔附钯银合金的热应力破坏
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