Chang Mao-Nan, Wu Yi-Shan, Lin Chiao-Jung, Hsueh Yu-Hsun, Su Chun-Jung, Lee Yao-Jen
Department of Physics, National Chung Hsing University, Taichung 402, Taiwan.
Institute of Nanoscience, National Chung Hsing University, Taichung 402, Taiwan.
Nanomaterials (Basel). 2024 May 26;14(11):934. doi: 10.3390/nano14110934.
This study developed a DC-free technique that used dark-mode scanning capacitance microscopy (DM-SCM) with a small-area contact electrode to evaluate and image equivalent oxide thicknesses (EOTs). In contrast to the conventional capacitance-voltage (C-V) method, which requires a large-area contact electrode and DC voltage sweeping to provide reliable C-V curves from which the EOT can be determined, the proposed method enabled the evaluation of the EOT to a few nanometers for thermal and high-k oxides. The signal intensity equation defining the voltage modulation efficiency in scanning capacitance microscopy (SCM) indicates that thermal oxide films on silicon can serve as calibration references for the establishment of a linear relationship between the SCM signal ratio and the EOT ratio; the EOT is then determined from this relationship. Experimental results for thermal oxide films demonstrated that the EOT obtained using the DM-SCM approach closely matched the value obtained using the typical C-V method for frequencies ranging from 90 kHz to 1 MHz. The percentage differences in EOT values between the C-V and SCM measurements were smaller than 0.5%. For high-k oxide films, DM-SCM with a DC-free operation may mitigate the effect of DC voltages on evaluations of EOTs. In addition, image operations were performed to obtain EOT images showing the EOT variation induced by DC-stress-induced charge trapping. Compared with the typical C-V method, the proposed DM-SCM approach not only provides a DC-free approach for EOT evaluation, but also offers a valuable opportunity to visualize the EOT distribution before and after the application of DC stress.
本研究开发了一种无直流技术,该技术使用具有小面积接触电极的暗模式扫描电容显微镜(DM-SCM)来评估等效氧化层厚度(EOT)并成像。与传统的电容-电压(C-V)方法不同,传统方法需要大面积接触电极和直流电压扫描来提供可靠的C-V曲线,以便从中确定EOT,而所提出的方法能够对热氧化层和高k氧化层的EOT进行几纳米的评估。定义扫描电容显微镜(SCM)中电压调制效率的信号强度方程表明,硅上的热氧化膜可作为校准参考,用于建立SCM信号比与EOT比之间的线性关系;然后根据这种关系确定EOT。热氧化膜的实验结果表明,使用DM-SCM方法获得的EOT与使用典型C-V方法在90 kHz至1 MHz频率范围内获得的值非常匹配。C-V测量和SCM测量之间的EOT值百分比差异小于0.5%。对于高k氧化膜,无直流操作的DM-SCM可以减轻直流电压对EOT评估的影响。此外,还进行了图像操作以获得EOT图像,该图像显示了由直流应力诱导的电荷俘获引起的EOT变化。与典型的C-V方法相比,所提出的DM-SCM方法不仅为EOT评估提供了一种无直流的方法,而且还提供了一个宝贵的机会来可视化施加直流应力前后的EOT分布。