铜/金刚石复合涂层的制备及其某些性能

Production of Cu/Diamond Composite Coatings and Their Selected Properties.

作者信息

Cieślak Grzegorz, Gostomska Marta, Dąbrowski Adrian, Skroban Katarzyna, Ciciszwili-Wyspiańska Tinatin, Wojda Edyta, Mazurek Anna, Głowacki Michał, Baranowski Michał, Gajewska-Midziałek Anna, Trzaska Maria

机构信息

Łukasiewicz Research Network-Warsaw Institute of Technology, Duchnicka 3, 01-796 Warsaw, Poland.

Faculty of Mechanical and Industrial Engineering, Warsaw University of Technology, Narbutta 85, 02-524 Warsaw, Poland.

出版信息

Materials (Basel). 2024 Jun 8;17(12):2803. doi: 10.3390/ma17122803.

DOI:10.3390/ma17122803

PMID:38930174

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11204481/

Abstract

This article presents Cu/diamond composite coatings produced by electrochemical reduction on steel substrates and a comparison of these coatings with a copper coating without diamond nanoparticles (<10 nm). Deposition was carried out using multicomponent electrolyte solutions at a current density of 3 A/dm and magnetic stirring speed of 100 rpm. Composite coatings were deposited from baths with different diamond concentrations (4, 6, 8, 10 g/dm). This study presents the surface morphology and structure of the produced coatings. The surface roughness, coating thickness (XRF), mechanical properties (DSI), and adhesion of coatings to substrates (scratch tests) were also characterized. The coatings were also tested to assess their solderability, including their spreadability, wettability of the solder, durability of solder-coating bonds, and a microstructure study.

摘要

本文介绍了通过电化学还原在钢基底上制备的铜/金刚石复合涂层，并将这些涂层与不含金刚石纳米颗粒（<10 nm）的铜涂层进行了比较。使用多组分电解质溶液在电流密度为3 A/dm²和磁力搅拌速度为100 rpm的条件下进行沉积。复合涂层从含有不同金刚石浓度（4、6、8、10 g/dm³）的镀液中沉积。本研究展示了所制备涂层的表面形貌和结构。还对涂层的表面粗糙度、涂层厚度（X射线荧光光谱法）、力学性能（动态静态压痕试验）以及涂层与基底的附着力（划痕试验）进行了表征。此外，还对涂层的可焊性进行了测试，包括其铺展性、焊料的润湿性、焊料-涂层结合的耐久性以及微观结构研究。