Zhou Ying, Hu Daochun, Chen Minghe, Wu Taowen, Ouyang Jindong, Xiong Degan
College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
School of Mechanical Engineering, Nanjing Vocational University of Industry Technology, Nanjing 210023, China.
Materials (Basel). 2024 Dec 10;17(24):6026. doi: 10.3390/ma17246026.
Spark plasma sintering (SPS) is an effective technique for studying the diffusion bonding of diamond/Cu composites, and has the potential to advance the application of copper matrix composites. This study investigates the SPS diffusion bonding of diamond/Cu composites using a chromium (Cr) interlayer. The effects of process parameters on the microstructure and mechanical properties of the bonding interface were evaluated through shear strength testing and SEM analysis. The results show that shear strength increases with interlayer thickness up to a certain point, after which it decreases. As the bonding temperature, holding time, and bonding pressure increase, defects such as cracks and voids at the diffusion-bonded interface are reduced, resulting in improved shear strength. Under suitable conditions (10 μm interlayer, 810 °C, 60 min, and 10 MPa), the bonding interface is defect-free, achieving a maximum shear strength of 139.89 MPa and a thermal conductivity (TC) of 700.97 W/(m·K), indicating high-quality diffusion bonding.
放电等离子烧结（SPS）是研究金刚石/Cu复合材料扩散连接的有效技术，并且具有推动铜基复合材料应用的潜力。本研究使用铬（Cr）中间层来研究金刚石/Cu复合材料的SPS扩散连接。通过剪切强度测试和扫描电子显微镜（SEM）分析，评估了工艺参数对连接界面微观结构和力学性能的影响。结果表明，剪切强度随中间层厚度增加到某一程度后会下降。随着连接温度、保温时间和连接压力的增加，扩散连接界面处的裂纹和孔隙等缺陷减少，从而提高了剪切强度。在合适的条件下（中间层厚度为10μm、温度为810℃、保温时间为60分钟、压力为10MPa），连接界面无缺陷，实现了139.89MPa的最大剪切强度和700.97W/(m·K)的热导率（TC），表明实现了高质量的扩散连接。
