Zhang Peng, Wang Hehe, Xia Pengcheng, Chen Xiaolei, Zhao Wei, Wang Chengqian, Meng Xiao, Jia Bin
China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 204035, China.
Minseoa Advanced Polyimide Corporation, Beijing 101300, China.
Polymers (Basel). 2024 Jun 26;16(13):1805. doi: 10.3390/polym16131805.
Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion (CTE) were prepared by dissolving polyimide precursor-poly(amide ester) (PAE) resins, photoinitiators, photocrosslinkers and other additives in organic solvents. Using triamine as a monomer and dianhydride and diamine as polycondensates, tri-branched structure PAE resins with different molecular weights named PAE-15 were prepared. A series of corresponding PSPI films named PSPI-15 were prepared from PAE-15 resins with the same formulation, respectively. The PSPI-15 films prepared from resins of this structure have excellent mechanical, thermal and electrical properties after being thermally cured at 350 °C/2 h in nitrogen. The PSPI-15 films' coating solution also show good photolithographic performance and are able to obtain photolithographic patterns with a resolution of about 10 μm after homogenization, exposure and development. Among the PSPI-15 films, PSPI-2 has the most excellent lithographic properties with a weight average molecular weight (M) of 2.9 × 10 g/mol, a CTE of 41 ppk/°C, a glass transition temperature (T) of 343 °C and a 5% weight loss temperature (T) of 520 °C, making it suitable for industrial scale-up. The mechanical properties of elongation at breakage of 42.4%, tensile moduli of 3.4 GPa and tensile strength of 153.7 MPa were also measured.
通过将聚酰亚胺前体聚（酰胺酯）（PAE）树脂、光引发剂、光交联剂和其他添加剂溶解在有机溶剂中，制备了具有低热膨胀系数（CTE）的负性光敏聚酰亚胺（PSPI）。以三胺为单体，二酐和二胺为缩聚剂，制备了不同分子量的三分支结构PAE树脂，命名为PAE-15。分别由PAE-15树脂按照相同配方制备了一系列相应的PSPI薄膜，命名为PSPI-15。由这种结构的树脂制备的PSPI-15薄膜在氮气中于350℃/2h热固化后具有优异的机械、热和电性能。PSPI-15薄膜的涂布溶液也表现出良好的光刻性能，在均化、曝光和显影后能够获得分辨率约为10μm的光刻图案。在PSPI-15薄膜中，PSPI-2具有最优异的光刻性能，其重均分子量（M）为2.9×10 g/mol，CTE为41 ppk/℃，玻璃化转变温度（T）为343℃，5%失重温度（T）为520℃，使其适合工业放大生产。还测量了其断裂伸长率为42.4%、拉伸模量为3.4 GPa和拉伸强度为153.7 MPa的机械性能。
