Jiang Gang-Lan, Wang Dong-Yang, Du Hao-Peng, Wu Xiao, Zhang Yan, Tan Yao-Yao, Wu Lin, Liu Jin-Gang, Zhang And Xiu-Min
Beijing Key Laboratory of Materials Utilization of Nonmetallic Minerals and Solid Wastes, National Laboratory of Mineral Materials, School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China.
Beijing National Laboratory for Molecular Sciences, Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.
Polymers (Basel). 2020 Feb 11;12(2):413. doi: 10.3390/polym12020413.
Semi-alicyclic colorless and transparent polyimide (CPI) films usually suffer from the high linear coefficients of thermal expansion (CTEs) due to the intrinsic thermo-sensitive alicyclic segments in the polymers. A series of semi-alicyclic CPI films containing rigid-rod amide moieties were successfully prepared in the current work in order to reduce the CTEs of the CPI films while maintaining their original optical transparency and solution-processability. For this purpose, two alicyclic dianhydrides, hydrogenated pyromellitic anhydride (HPMDA, I), and hydrogenated 3,3',4,4'-biphenyltetracarboxylic dianhydride (HBPDA, II) were polymerized with two amide-bridged aromatic diamines, 2-methyl-4,4'-diaminobenzanilide (MeDABA, a) and 2-chloro-4,4'-diaminobenzanilide (ClDABA, b) respectively to afford four CPI resins. The derived CPI resins were all soluble in polar aprotic solvents, including -methyl-2-pyrrolidone (NMP) and ,-dimethylacetamide (DMAc). Flexible and tough CPI films were successfully prepared by casing the PI solutions onto glass substrates followed by thermally cured at elevated temperatures from 80 °C to 250 °C. The MeDABA derived PI-I (HPMDA-MeDABA) and PI-II (HBPDA-MeDABA) exhibited superior optical transparency compared to those derived from ClDABA (PI-I and PI-II). PI-I and PI-II showed the optical transmittances of 82.3% and 85.8% at the wavelength of 400 nm with a thickness around 25 μm, respectively. Introduction of rigid-rod amide moiety endowed the HPMDA-PI films good thermal stability at elevated temperatures with the CTE values of 33.4 × 10/K for PI-I and 27.7 × 10/K for PI-I in the temperature range of 50-250 °C. Comparatively, the HBPDA-PI films exhibited much higher CTE values. In addition, the HPMDA-PI films exhibited good thermal stability with the 5% weight loss temperatures () higher than 430 °C and glass transition temperatures () in the range of 349-351 °C.
半脂环族无色透明聚酰亚胺(CPI)薄膜通常因聚合物中固有的热敏脂环族链段而具有较高的热膨胀线性系数(CTE)。为了在保持其原始光学透明度和溶液可加工性的同时降低CPI薄膜的CTE,本工作成功制备了一系列含有刚性棒状酰胺基团的半脂环族CPI薄膜。为此,将两种脂环族二酐,氢化均苯四甲酸二酐(HPMDA,I)和氢化3,3',4,4'-联苯四甲酸二酐(HBPDA,II)分别与两种酰胺桥连的芳族二胺,2-甲基-4,4'-二氨基苯甲酰苯胺(MeDABA,a)和2-氯-4,4'-二氨基苯甲酰苯胺(ClDABA,b)聚合,得到四种CPI树脂。所得的CPI树脂均溶于极性非质子溶剂,包括N-甲基-2-吡咯烷酮(NMP)和N,N-二甲基乙酰胺(DMAc)。通过将PI溶液浇铸在玻璃基板上,然后在80℃至250℃的高温下热固化,成功制备了柔性且坚韧的CPI薄膜。与由ClDABA衍生的薄膜(PI-I和PI-II)相比,由MeDABA衍生的PI-I(HPMDA-MeDABA)和PI-II(HBPDA-MeDABA)表现出优异的光学透明度。PI-I和PI-II在波长400nm、厚度约25μm时的透光率分别为82.3%和85.8%。刚性棒状酰胺基团的引入使HPMDA-PI薄膜在高温下具有良好的热稳定性,在50-250℃温度范围内,PI-I的CTE值为33.4×10⁻⁶/K,PI-II的CTE值为27.7×10⁻⁶/K。相比之下,HBPDA-PI薄膜表现出更高的CTE值。此外,HPMDA-PI薄膜表现出良好的热稳定性,5%失重温度(T₅)高于430℃,玻璃化转变温度(T₉)在349-351℃范围内。