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通过ITO表面电荷转移掺杂提高P沟道CuIBr薄膜晶体管的性能

Enhanced Performance of P-Channel CuIBr Thin-Film Transistor by ITO Surface Charge-Transfer Doping.

作者信息

Gao Ming, Wei Wei, Wang Zhiyong, Yu Zhi Gen, Zhang Yong-Wei, Zhu Chunxiang

机构信息

Department of Electrical and Computer Engineering, College of Design and Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117583, Singapore.

Agency for Science, Technology and Research (A*STAR), Institute of High Performance Computing, 1 Fusionopolis Way, No. 16-16 Connexis, Singapore 138632, Singapore.

出版信息

ACS Appl Mater Interfaces. 2024 Aug 7;16(31):41176-41184. doi: 10.1021/acsami.4c07955. Epub 2024 Jul 29.

Abstract

The process development and optimization of p-type semiconductors and p-channel thin-film transistors (TFTs) are essential for the development of high-performance circuits. In this study, the Br-doped CuI (CuIBr) TFTs are proposed by the solution process to control copper vacancy generation and suppress excess holes formation in p-type CuI films and improve current modulation capabilities for CuI TFTs. The CuIBr films exhibit a uniform surface morphology and good crystalline quality. The on/off current (/) ratio of CuIBr TFTs increased from 10 to 10 with an increase in the Br doping ratio from 0 to 15%. Furthermore, the performance and operational stability of CuIBr TFTs are significantly enhanced by indium tin oxide (ITO) surface charge-transfer doping. The results obtained from the first-principles calculations well explain the electron-doping effect of ITO overlayer in CuIBr TFT. Eventually, the CuIBr TFT with 15% Br content exhibits a high / ratio of 3 × 10 and a high hole field-effect mobility (μ) of 7.0 cm V s. The band-like charge transport in CuIBr TFT is confirmed by the temperature-dependent measurement. This study paves the way for the realization of transparent complementary circuits and wearable electronics.

摘要

p型半导体和p沟道薄膜晶体管(TFT)的工艺开发与优化对于高性能电路的发展至关重要。在本研究中,通过溶液法提出了掺溴的碘化亚铜(CuIBr)TFT,以控制铜空位的产生并抑制p型CuI薄膜中过量空穴的形成,并提高CuI TFT的电流调制能力。CuIBr薄膜呈现出均匀的表面形貌和良好的晶体质量。随着溴掺杂比例从0增加到15%,CuIBr TFT的开/关电流(I)比从10增加到10。此外,通过氧化铟锡(ITO)表面电荷转移掺杂,CuIBr TFT的性能和操作稳定性得到显著增强。第一性原理计算得到的结果很好地解释了ITO覆盖层在CuIBr TFT中的电子掺杂效应。最终,溴含量为15%的CuIBr TFT表现出3×10的高I比和7.0 cm² V⁻¹ s⁻¹的高空穴场效应迁移率(μ)。通过温度相关测量证实了CuIBr TFT中的带状电荷传输。本研究为实现透明互补电路和可穿戴电子设备铺平了道路。

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