Yuan Yunhuan, Ding Chaogang, Yin Rui, Lu Shun, Xu Jie, Ren Wei, Li Kang, Zhao Weiwei
Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, China.
Key Laboratory of Micro-Systems and Micro-Structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150001, China.
Materials (Basel). 2024 Aug 1;17(15):3784. doi: 10.3390/ma17153784.
Flexible thermoelectric materials have drawn significant attention from researchers due to their potential applications in wearable electronics and the Internet of Things. Despite many reports on these materials, it remains a significant challenge to develop cost-effective methods for large-scale, patterned fabrication of materials that exhibit both excellent thermoelectric performance and remarkable flexibility. In this study, we have developed an AgSe-based ink with excellent printability that can be used to fabricate flexible thermoelectric films by screen printing and low-temperature sintering. The printed films exhibit a Seebeck coefficient of -161 μV/K and a power factor of 3250.9 μW/m·K at 400 K. Moreover, the films demonstrate remarkable flexibility, showing minimal changes in resistance after being bent 5000 times at a radius of 5 mm. Overall, this research offers a new opportunity for the large-scale patterned production of flexible thermoelectric films.
柔性热电材料因其在可穿戴电子设备和物联网中的潜在应用而受到研究人员的广泛关注。尽管已有许多关于这些材料的报道，但开发出具有成本效益的方法来大规模、图案化制造兼具优异热电性能和显著柔韧性的材料仍然是一项重大挑战。在本研究中，我们开发了一种具有优异可印刷性的基于AgSe的墨水，可用于通过丝网印刷和低温烧结来制造柔性热电薄膜。印刷薄膜在400 K时的塞贝克系数为-161 μV/K，功率因数为3250.9 μW/m·K。此外，这些薄膜表现出显著的柔韧性，在半径为5 mm的情况下弯曲5000次后电阻变化极小。总体而言，这项研究为柔性热电薄膜的大规模图案化生产提供了新的机遇。
