Xue Guodong, Qin Biao, Ma Chaojie, Yin Peng, Liu Can, Liu Kaihui
State Key Laboratory for Mesoscopic Physics, Frontiers Science Center for Nano-optoelectronics, School of Physics, Peking University, Beijing 100871, China.
Academy for Advanced Interdisciplinary Studies, Peking University, Beijing 100871, China.
Chem Rev. 2024 Sep 11;124(17):9785-9865. doi: 10.1021/acs.chemrev.3c00851. Epub 2024 Aug 12.
Over the past decade, research on atomically thin two-dimensional (2D) transition metal dichalcogenides (TMDs) has expanded rapidly due to their unique properties such as high carrier mobility, significant excitonic effects, and strong spin-orbit couplings. Considerable attention from both scientific and industrial communities has fully fueled the exploration of TMDs toward practical applications. Proposed scenarios, such as ultrascaled transistors, on-chip photonics, flexible optoelectronics, and efficient electrocatalysis, critically depend on the scalable production of large-area TMD films. Correspondingly, substantial efforts have been devoted to refining the synthesizing methodology of 2D TMDs, which brought the field to a stage that necessitates a comprehensive summary. In this Review, we give a systematic overview of the basic designs and significant advancements in large-area epitaxial growth of TMDs. We first sketch out their fundamental structures and diverse properties. Subsequent discussion encompasses the state-of-the-art wafer-scale production designs, single-crystal epitaxial strategies, and techniques for structure modification and postprocessing. Additionally, we highlight the future directions for application-driven material fabrication and persistent challenges, aiming to inspire ongoing exploration along a revolution in the modern semiconductor industry.
在过去十年中,对原子级薄的二维(2D)过渡金属二硫属化物(TMD)的研究迅速扩展,这归因于它们的独特性质,如高载流子迁移率、显著的激子效应和强自旋轨道耦合。科学界和工业界的广泛关注充分推动了对TMD实际应用的探索。诸如超大规模晶体管、片上光子学、柔性光电子学和高效电催化等设想方案,严重依赖于大面积TMD薄膜的可扩展生产。相应地,人们已投入大量努力来完善二维TMD的合成方法,这使该领域发展到需要全面总结的阶段。在本综述中,我们对TMD大面积外延生长的基本设计和重大进展进行了系统概述。我们首先概述它们的基本结构和多样性质。随后的讨论涵盖了最先进的晶圆级生产设计、单晶外延策略以及结构修饰和后处理技术。此外,我们强调了应用驱动的材料制造的未来方向和持续面临的挑战,旨在激发沿着现代半导体行业一场革命的持续探索。