Ren Xiaoyan, Shi Zhenghua, Zhang Guowei, Chen Ningning, Zhang Yougui, Guo Zhiming, Hu Jinzhi, Xu Hong
Dept. of Mechanical Engineering, Taiyuan Institute of Technology Shanxi Taiyuan, 030008, China.
School of Materials Science and Engineering, North University of China, Shanxi, Taiyuan, 030051, China.
Heliyon. 2024 Jul 14;10(15):e34624. doi: 10.1016/j.heliyon.2024.e34624. eCollection 2024 Aug 15.
The influence of the sub-nano NiP and CuP phases on the microstructure, mechanical properties, and strengthening mechanism of Cu-20Pb-5Sn-xP (x = 0,0.05,0.1,0.3,0.5) alloy were discussed under the addition of P to obtain a new Pb-Sn bronze alloy applying for bimetallic cylinder block. The results showed that the tensile strength and hardness of the Pb-Sn bronze alloy increase with the P contents, while the elongation increased first and then decreased. The main strengthen mechanism was that sub-nano NiP and CuP phases dispersed in the matrix, hindering the movement of dislocations during deformation. Additionally, the grain refinement also contributed to the improvement of mechanical properties. The NiP phase is easier to form than the CuP phase. And it is easier to combine with the matrix and more stable. The NiP and CuP phases were studied by using different characterization techniques, such as OM, SEM, EDS, XRD, TEM and First-principles, Phase diagram calculation method. When P is added to the alloy, the NiP phase first appears in the alloy, and when the P content increases to more than 0.3 wt%, the CuP phase begins to appear. This is because the NiP phase is easier to form than the CuP phase and is more stable. Only after part of P reacts with Ni dissolved in copper to form NiP, the remaining P and Cu can form CuP.
研究了添加磷以获得一种用于双金属气缸体的新型铅锡青铜合金时，亚纳米NiP和CuP相对Cu-20Pb-5Sn-xP（x = 0、0.05、0.1、0.3、0.5）合金的微观结构、力学性能和强化机制的影响。结果表明，铅锡青铜合金的抗拉强度和硬度随磷含量的增加而提高，而伸长率则先增加后降低。主要强化机制是亚纳米NiP和CuP相弥散分布在基体中，阻碍了变形过程中位错的运动。此外，晶粒细化也有助于力学性能的提高。NiP相比CuP相更容易形成，并且更容易与基体结合且更稳定。利用光学显微镜（OM）、扫描电子显微镜（SEM）、能谱仪（EDS）、X射线衍射仪（XRD）、透射电子显微镜（TEM）和第一性原理、相图计算方法等不同表征技术对NiP和CuP相进行了研究。向合金中添加磷时，NiP相首先在合金中出现，当磷含量增加到超过0.3 wt%时，CuP相开始出现。这是因为NiP相比CuP相更容易形成且更稳定。只有部分磷与溶解在铜中的镍反应形成NiP后，剩余的磷和铜才能形成CuP。
