Elsayed Hussein A, Mohamed Aliaa G, El-Sherbeeny Ahmed M, Aly Arafa H, Abukhadra Mostafa R, Al Zoubi Wail, Mehaney Ahmed
TH-PPM Group, Physics Department, Faculty of Science, Beni-Suef University, Beni-Suef, 62512, Egypt.
Industrial Engineering Department, College of Engineering, King Saud University, P.O. Box 800, 11421, Riyadh, Saudi Arabia.
Sci Rep. 2024 Aug 26;14(1):19733. doi: 10.1038/s41598-024-69751-3.
This paper seeks to progress the field of topological photonic crystals (TPC) as a promising tool in face of construction flaws. In particular, the structure can be used as a novel temperature sensor. In this regard, the considered TPC structure comprising two different PC designs named PC and PC. PC is designed from a stack of multilayers containing Silicon (Si) and Silicon dioxide (SiO), while layers of SiO and composite layer named hyperbolic metamaterial (HMM) are considered in designing PC. The HMM layer is engineered using subwavelength layers of Si and Bismuth Germinate, or BGO ( ). The mainstay of our suggested temperature sensor is mainly based on the emergence of some resonant modes inside the transmittance spectrum that provide the stability in the presence of the geometrical changes. Meanwhile, our theoretical framework has been introduced in the vicinity of transfer matrix method (TMM), effective medium theory (EMT) and the thermo-optic characteristics of the considered materials. The numerical findings have extensively introduced the role of some topological parameters such as layers' thicknesses, filling ratio through HMM layers and the periodicity of HMM on the stability or the topological features of the introduced sensor. Meanwhile, the numerical results reveal that the considered design provides some topological edge states (TESs) of a promising robustness and stability against certain disturbances or geometrical changes in the constituent materials. In addition, our sensing tool offers a relatively high sensitivity of 0.27 nm/°C.
本文旨在推动拓扑光子晶体(TPC)领域的发展,使其成为应对结构缺陷的一种有前景的工具。特别是,该结构可作为一种新型温度传感器。在这方面,所考虑的TPC结构由两种不同的光子晶体(PC)设计组成,分别命名为PC和PC。PC由包含硅(Si)和二氧化硅(SiO)的多层堆叠设计而成,而在设计PC时考虑了SiO层和名为双曲线超材料(HMM)的复合层。HMM层使用硅和锗酸铋(BGO)的亚波长层进行设计。我们所建议的温度传感器的主要依据主要是透过率光谱中出现的一些共振模式,这些模式在存在几何变化的情况下提供稳定性。同时,我们的理论框架是在传输矩阵法(TMM)、有效介质理论(EMT)以及所考虑材料的热光特性的基础上引入的。数值结果广泛介绍了一些拓扑参数的作用,如层厚度、通过HMM层的填充率以及HMM的周期性对所引入传感器的稳定性或拓扑特征的影响。同时,数值结果表明,所考虑的设计提供了一些具有良好鲁棒性和稳定性的拓扑边缘态(TESs),能够抵抗组成材料中的某些干扰或几何变化。此外,我们的传感工具具有相对较高的灵敏度,为0.27nm/°C。