Chen Silu, Rowley Ben, Ganganahalli Ramesha, Yeo Boon Siang
Department of Chemistry, Faculty of Science, National University of Singapore, 3 Science Drive 3, Singapore, 117543, Singapore.
Energy Transition Campus Amsterdam, Grasweg 31, 1031 HW, Amsterdam, The Netherlands.
Adv Sci (Weinh). 2024 Oct;11(40):e2405938. doi: 10.1002/advs.202405938. Epub 2024 Aug 26.
This work shows how hydrophobicity and porosity can be incorporated into copper catalyst layers (CLs) for the efficient electroreduction of CO (CORR) in a flow cell. Oxide-derived (OD) Cu catalysts are synthesized using K and Cs as templates, termed respectively as OD-Cu-K and OD-Cu-Cs. CLs, assembled from OD-Cu-K and OD-Cu-Cs, exhibit enhanced CORR performance compared to "unmodified" OD-Cu CL. OD-Cu-Cs can notably reduce CO to C products with Faradaic efficiencies (FE) as high as 96% (or 4% FE H). During CO electrolysis at -3000 mA cm (-0.73 V vs reversible hydrogen electrode), C products and the alcohols are formed with respective current densities of -2804 and -1205 mA cm . The mesopores in the OD-Cu-Cs CL act as barriers against electrolyte flooding. Contact angle measurements confirm the CL's hydrophobicity ranking: OD-Cu-Cs > OD-Cu-K > OD-Cu. The enhanced hydrophobicity of a catalyst is proposed to allow more triple-phase (CO-electrolyte-catalyst) interfaces to be available for CORR. This study shows how the pore size-hydrophobicity relationship can be harvested to guide the design of a less-is-more Cu electrode, which can attain high CORR current density and selectivity, without the additional use of hydrophobic polytetrafluoroethylene particles or dopants, such as Ag.
这项工作展示了如何将疏水性和孔隙率引入铜催化剂层(CLs),以在流动池中实现高效的一氧化碳电还原(CORR)。使用钾和铯作为模板合成氧化物衍生(OD)铜催化剂,分别称为OD-Cu-K和OD-Cu-Cs。由OD-Cu-K和OD-Cu-Cs组装而成的CLs,与“未改性”的OD-Cu CL相比,表现出增强的CORR性能。OD-Cu-Cs能显著将一氧化碳还原为碳产物,法拉第效率(FE)高达96%(或氢的FE为4%)。在-3000 mA cm(相对于可逆氢电极-0.73 V)的一氧化碳电解过程中,形成碳产物和醇类,其电流密度分别为-2804和-1205 mA cm 。OD-Cu-Cs CL中的中孔起到防止电解液淹没的屏障作用。接触角测量证实了CLs的疏水性排序:OD-Cu-Cs > OD-Cu-K > OD-Cu。有人提出,催化剂疏水性的增强可使更多的三相(一氧化碳-电解液-催化剂)界面可用于CORR。这项研究展示了如何利用孔径-疏水性关系来指导设计一种“少即是多”的铜电极,该电极无需额外使用疏水性聚四氟乙烯颗粒或掺杂剂(如银)就能实现高CORR电流密度和选择性。