Zhang Peng, Hua Haowen, Gu Ying, Gong Yi, Huang Mengyang, Yang Wenxian, Zhu Jianjun, Long Shibing, Lu Shulong
Opt Lett. 2024 Sep 1;49(17):4954-4957. doi: 10.1364/OL.533252.
In recent years, III-Nitride-based micro light-emitting diodes (micro-LEDs) have emerged in many fields and gained more attention. However, fabricating high-efficiency micro-LEDs still remains a challenge due to the presence of sidewall damage. In this study, a GaN-based single blue micro-LED with a full-M-sided hexagonal mesa was prepared. The mesa has a circumradius of 10 µm and was treated with a tetramethylammonium hydroxide (TMAH) solution. Experimental results show that the sidewall defects introduced by dry etching damage act as non-radiative recombination centers and greatly impair the performance of the device. By constructing a full-M-sided hexagonal structure and soaking in a TMAH solution, the etching damage on the sidewall can be eliminated to the greatest extent, thereby reducing sidewall defects. In consequence, the peak EQE of the devices treated with the TMAH solution exceeded 10% at low current density, an increase of 9% compared with the untreated samples. This work provides, to our knowledge, a new approach to improving the efficiency of GaN-based micro-LEDs.
近年来,基于III族氮化物的微型发光二极管(微型LED)在许多领域崭露头角并受到更多关注。然而,由于存在侧壁损伤,制造高效微型LED仍然是一项挑战。在本研究中,制备了具有全M面六边形台面的GaN基单蓝色微型LED。该台面的外接圆半径为10 µm,并用氢氧化四甲铵(TMAH)溶液进行处理。实验结果表明,干法刻蚀损伤引入的侧壁缺陷充当非辐射复合中心,极大地损害了器件的性能。通过构建全M面六边形结构并浸泡在TMAH溶液中,可以最大程度地消除侧壁上的刻蚀损伤,从而减少侧壁缺陷。结果,在低电流密度下,经TMAH溶液处理的器件的峰值外量子效率(EQE)超过10%,与未处理的样品相比提高了9%。据我们所知,这项工作提供了一种提高GaN基微型LED效率的新方法。