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基于激光粉末床熔融技术的高性能增材制造铜绕组的制备

On the Fabrication of High-Performance Additively Manufactured Copper Winding Using Laser Powder Bed Fusion.

作者信息

Abdelhafiz Mohamed, Emadi Ali, Elbestawi Mohamed A

机构信息

Additive Manufacturing Group (AMG), Department of Mechanical Engineering, McMaster University, 1280 Main Street West, Hamilton, ON L8S 4L7, Canada.

Department of Electrical & Computer Engineering, McMaster University, 1280 Main Street West, Hamilton, ON L8S 4K1, Canada.

出版信息

Materials (Basel). 2023 Jun 29;16(13):4694. doi: 10.3390/ma16134694.

Abstract

Due to its exceptional electrical and thermal conductivity, pure copper is frequently employed in industry as the base metal for thermal management and electromagnetic applications. The growing need for complicated and efficient motor designs has recently accelerated the development of copper additive manufacturing (AM). The present work aims to improve the power density of the copper laser powder bed fusion (Cu-LPBF) coil by increasing the slot-filling factor (SFF) and the electrical conductivity. Firstly, the dimensional limitation of Cu-LPBF fabricated parts was identified. Sample contouring and adjusting beam offset associated with optimum scan track morphology upgraded the minimum feature spacing to 80 μm. Accordingly, the printed winding's slot-filling factor increased to 79% for square wire and 63% for round wire. A maximum electrical conductivity of 87% (IACS) was achieved by heat treatment (HT). The electrical impedance of full-size Cu-LPBF coils, newly reported in this study, was measured and compared with solid wire. It can reflect the performance of Cu-LPBF coils (power factor) in high-frequency applications. Furthermore, surface quality benefited from either sample contouring and HT, where the side surface roughness was lowered by 45% and an additional reduction of 25% after HT.

摘要

由于其卓越的导电性和导热性,纯铜在工业中经常被用作热管理和电磁应用的基础金属。对复杂高效电机设计的需求不断增长,最近加速了铜添加剂制造(AM)的发展。目前的工作旨在通过提高槽满率(SFF)和电导率来提高铜激光粉末床熔融(Cu-LPBF)线圈的功率密度。首先,确定了Cu-LPBF制造零件的尺寸限制。与最佳扫描轨迹形态相关的样品轮廓加工和调整光束偏移将最小特征间距提高到了80μm。相应地,方形导线的印刷绕组槽满率提高到了79%,圆形导线的槽满率提高到了63%。通过热处理(HT)实现了87%(IACS)的最大电导率。本研究新报道了全尺寸Cu-LPBF线圈的电阻抗,并与实心导线进行了比较。它可以反映Cu-LPBF线圈在高频应用中的性能(功率因数)。此外,样品轮廓加工和热处理均有利于表面质量,侧面粗糙度降低了45%,热处理后又额外降低了25%。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1641/10342347/c318ca9e7897/materials-16-04694-g0A1.jpg

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