Zhou Yunxuan, Lv Hao, Chen Tao, Tong Shijun, Zhang Yulin, Wang Bin, Tan Jun, Chen Xianhua, Pan Fusheng
Lanxi Magnesium Materials Research Institute, Lanxi 321100, China.
National Engineering Research Center for Magnesium Alloys, College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China.
Molecules. 2024 Aug 31;29(17):4138. doi: 10.3390/molecules29174138.
The interface connects the reinforced phase and the matrix of materials, with its microstructure and interfacial configurations directly impacting the overall performance of composites. In this study, utilizing seven atomic layers of Mg(0001) and Ti(0001) surface slab models, four different Mg(0001)/Ti(0001) interfaces with varying atomic stacking configurations were constructed. The calculated interface adhesion energy and electronic bonding information of the Mg(0001)/Ti(0001) interface reveal that the HCP2 interface configuration exhibits the best stability. Moreover, Si, Ca, Sc, V, Cr, Mn, Fe, Cu, Zn, Y, Zr, Nb, Mo, Sn, La, Ce, Nd, and Gd elements are introduced into the Mg/Ti interface layer or interfacial sublayer of the HCP2 configurations, and their interfacial segregation behavior is investigated systematically. The results indicate that Gd atom doping in the Mg(0001)/Ti(0001) interface exhibits the smallest heat of segregation, with a value of -5.83 eV. However, Ca and La atom doping in the Mg(0001)/Ti(0001) interface show larger heat of segregation, with values of 0.84 and 0.63 eV, respectively. This implies that the Gd atom exhibits a higher propensity to segregate at the interface, whereas the Ca and La atoms are less inclined to segregate. Moreover, the electronic density is thoroughly analyzed to elucidate the interfacial segregation behavior. The research findings presented in this paper offer valuable guidance and insights for designing the composition of magnesium-based composites.
该界面连接材料的增强相和基体,其微观结构和界面构型直接影响复合材料的整体性能。在本研究中,利用Mg(0001)和Ti(0001)表面平板模型的七个原子层,构建了四种具有不同原子堆叠构型的Mg(0001)/Ti(0001)界面。Mg(0001)/Ti(0001)界面的计算界面结合能和电子键合信息表明,HCP2界面构型表现出最佳稳定性。此外,将Si、Ca、Sc、V、Cr、Mn、Fe、Cu、Zn、Y、Zr、Nb、Mo、Sn、La、Ce、Nd和Gd元素引入HCP2构型的Mg/Ti界面层或界面亚层,并系统研究了它们的界面偏析行为。结果表明,Mg(0001)/Ti(0001)界面中的Gd原子掺杂表现出最小的偏析热,值为-5.83 eV。然而,Mg(0001)/Ti(0001)界面中的Ca和La原子掺杂表现出较大的偏析热,值分别为0.84和0.63 eV。这意味着Gd原子在界面处具有更高的偏析倾向,而Ca和La原子则不太倾向于偏析。此外,对电子密度进行了深入分析以阐明界面偏析行为。本文提出的研究结果为镁基复合材料的成分设计提供了有价值的指导和见解。