Thayer School of Engineering, Dartmouth College, Hanover, New Hampshire, USA; email:
Research Institute of Electronics, Shizuoka University, Hamamatsu, Japan.
Annu Rev Vis Sci. 2024 Sep;10(1):171-198. doi: 10.1146/annurev-vision-101322-105538.
This article reviews nearly 60 years of solid-state image sensor evolution and identifies potential new frontiers in the field. From early work in the 1960s, through the development of charge-coupled device image sensors, to the complementary metal oxide semiconductor image sensors now ubiquitous in our lives, we discuss highlights in the evolutionary chain. New frontiers, such as 3D stacked technology, photon-counting technology, and others, are briefly discussed.
本文回顾了近 60 年的固态图像传感器的发展历程，并确定了该领域的潜在新前沿。从 20 世纪 60 年代的早期工作开始，历经电荷耦合器件图像传感器的发展，再到如今我们生活中无处不在的互补金属氧化物半导体图像传感器，我们探讨了发展链中的亮点。本文还简要讨论了新的前沿领域，如 3D 堆叠技术、光子计数技术等。
