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通过原子层沉积法制备的二氧化钒:下一代存储器件的一种有前景的材料。

Vanadium Dioxide by Atomic Layer Deposition: A Promising Material for Next-Generation Memory Devices.

作者信息

Ratier Thomas, Rigollet Salomé, Martins Paolo, Garabedian Patrick, Eustache Etienne, Brunel David

机构信息

Thales Research and Technology, Campus Ecole Polytechnique, 1 avenue Augustin Fresnel, 91767 Palaiseau Cedex, France.

出版信息

J Phys Chem Lett. 2024 Sep 26;15(38):9811-9819. doi: 10.1021/acs.jpclett.4c02192. Epub 2024 Sep 18.

Abstract

The synthesis of a vanadium dioxide (VO) film using atomic layer deposition (ALD) with vanadium tetrachloride (VCl) as a precursor for the realization of programmable memory devices is reported. X-ray diffraction analysis revealed the epitaxial growth of VO on c-AlO. The phase transition was monitored using resistivity measurements across varying temperatures, demonstrating a decrease of >4 orders of magnitude at the transition temperature, thereby confirming the high quality of the material. From this material, memristive devices are fabricated as resistive random-access memory (RRAM). On the basis of spiking voltage inputs, these RRAM exhibited cycle stability over 512 cycles and state retention stability for >450 s, showing <2% drift. With respect to synaptic-like applications, the RRAM devices were piloted through step patterns to enable multilevel memory states. These ALD-grown VO-based devices demonstrate potential for use as synaptic connections with multiweight synapses, advancing scalability in neuromorphic applications.

摘要

报道了使用四氯化钒(VCl)作为前驱体通过原子层沉积(ALD)合成二氧化钒(VO)薄膜以实现可编程存储器件。X射线衍射分析表明VO在c-AlO上外延生长。通过在不同温度下测量电阻率来监测相变,结果表明在转变温度下电阻率下降超过4个数量级,从而证实了材料的高质量。用这种材料制造忆阻器件作为电阻式随机存取存储器(RRAM)。基于尖峰电压输入,这些RRAM在512个周期内表现出循环稳定性,状态保持稳定性超过450秒,漂移小于2%。对于类似突触的应用,通过步进模式驱动RRAM器件以实现多级存储状态。这些基于ALD生长的VO器件展示了用作具有多权重突触的突触连接的潜力,推动了神经形态应用中的可扩展性。

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