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AlO磨料在钽化学机械抛光中的作用机制

Interaction mechanism of AlO abrasive in tantalum chemical mechanical polishing.

作者信息

Lei Rui, Jiang Liang, Zhang Honglin, Chen Yushan, Zheng Jiaxin, Sun Junhui, Zhao Qijian, Qian Linmao

机构信息

Tribology Research Institute, State Key Laboratory of Rail Transit Vehicle System, Southwest Jiaotong University Chengdu 610031 China

State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences Lanzhou 730000 China.

出版信息

RSC Adv. 2024 Sep 18;14(40):29559-29568. doi: 10.1039/d4ra03743j. eCollection 2024 Sep 12.

DOI:10.1039/d4ra03743j
PMID:39297042
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11408988/
Abstract

AlO abrasive is expected to enhance chemical mechanical polishing (CMP) efficiency compared to the SiO abrasive. However, AlO powder has dispersion issues and the material removal mechanism by AlO remains unclear. This study investigated the role of AlO abrasive in the tantalum CMP. It is revealed that (NaPO) can effectively disperse AlO powder in water. PO improves the stability while Na deteriorates it. The total Na concentration should be lower than the turning point to attain high stability. With stable AlO-containing slurries, a relatively high material removal rate of tantalum can be obtained at an alkaline pH. The characterization results indicate that the Ta element can be adsorbed on AlO probably due to the chemical interaction between AlO and the tantalum surface. Moreover, the AlO microsphere tip starts to remove tantalum at 0.48 GPa, which is much lower than the yield strength of the tantalum surface film. For the mechanism, tantalum can be oxidized by HO at alkaline pH. When AlO presses and slides on the tantalum surface, tribochemical reactions occur, forming a chemical bond of Al-O-Ta at the interface. As AlO moves, the bond is stretched and tantalum is detached. The findings provide mechanistic insight into AlO abrasive in CMP.

摘要

与SiO磨料相比，AlO磨料有望提高化学机械抛光（CMP）效率。然而，AlO粉末存在分散问题，且AlO的材料去除机制仍不明确。本研究调查了AlO磨料在钽化学机械抛光中的作用。结果表明，(NaPO)能有效将AlO粉末分散在水中。PO提高稳定性，而Na则降低稳定性。总Na浓度应低于转折点以获得高稳定性。使用稳定的含AlO浆料，在碱性pH值下可获得相对较高的钽材料去除率。表征结果表明，Ta元素可能由于AlO与钽表面之间的化学相互作用而吸附在AlO上。此外，AlO微球尖端在0.48 GPa时开始去除钽，这远低于钽表面膜的屈服强度。对于其机制，在碱性pH值下钽可被HO氧化。当AlO在钽表面挤压和滑动时，发生摩擦化学反应，在界面处形成Al-O-Ta化学键。随着AlO移动，该键被拉伸，钽被分离。这些发现为化学机械抛光中AlO磨料的作用机制提供了深入了解。

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