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有机半导体的图案化实现功能集成:从单元器件到集成电子学。

Patterning of Organic Semiconductors Leads to Functional Integration: From Unit Device to Integrated Electronics.

作者信息

Choi Wangmyung, Kim Yeo Eun, Yoo Hocheon

机构信息

Department of Semiconductor Engineering, Gachon University, Seongnam 13120, Republic of Korea.

Department of Electronic Engineering, Gachon University, Seongnam 13120, Republic of Korea.

出版信息

Polymers (Basel). 2024 Sep 15;16(18):2613. doi: 10.3390/polym16182613.

Abstract

The use of organic semiconductors in electronic devices, including transistors, sensors, and memories, unlocks innovative possibilities such as streamlined fabrication processes, enhanced mechanical flexibility, and potential new applications. Nevertheless, the increasing technical demand for patterning organic semiconductors requires greater integration and functional implementation. This paper overviews recent efforts to pattern organic semiconductors compatible with electronic devices. The review categorizes the contributions of organic semiconductor patterning approaches, such as surface-grafting polymers, capillary force lithography, wettability, evaporation, and diffusion in organic semiconductor-based transistors and sensors, offering a timely perspective on unconventional approaches to enable the patterning of organic semiconductors with a strong focus on the advantages of organic semiconductor utilization. In addition, this review explores the opportunities and challenges of organic semiconductor-based integration, emphasizing the issues related to patterning and interconnection.

摘要

有机半导体在包括晶体管、传感器和存储器在内的电子设备中的应用,开启了诸如简化制造工艺、增强机械柔韧性以及潜在新应用等创新可能性。然而,对有机半导体进行图案化处理的技术需求不断增加,这就需要更高程度的集成和功能实现。本文概述了近期为使有机半导体与电子设备兼容而进行图案化处理的相关努力。该综述对有机半导体图案化方法的贡献进行了分类,例如在基于有机半导体的晶体管和传感器中的表面接枝聚合物、毛细力光刻、润湿性、蒸发和扩散等方法,及时提供了关于非常规方法的观点,以实现有机半导体的图案化,特别关注有机半导体利用的优势。此外,本综述探讨了基于有机半导体的集成所面临的机遇和挑战,强调了与图案化和互连相关的问题。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5b64/11435555/5448fc44e87d/polymers-16-02613-g003.jpg

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