Enhancing thermal transport of epoxy composites with vertically aligned graphene grown on the thermal interface.

The escalating demands for miniaturization, integration, and portability in electronic devices have underscored the criticality of efficient heat dissipation. The utilization of high-performance thermal interface materials (TIMs) to fill the gaps between contacting surfaces holds significant potential for enhancing heat transfer efficiency. Herein, we successfully enhance the thermal properties of the epoxy composite TIM by integrating grown vertically aligned graphene on the metal surface using radio frequency plasma-enhanced chemical vapor deposition (RF-PECVD). To investigate the effect of vertical graphene on epoxy, the sandwich structure of copper/vertical graphene-epoxy/copper (Cu/VG-EP/Cu) is fabricated by incorporating epoxy resin. The experimental results demonstrate that the thermal conductivity of VG-EP reaches 2.06 W m K and achieves an impressive 1215% maximum enhancement. Furthermore, the numerical simulation findings show that vertical graphene consistent with the temperature gradient exhibits the highest heat transfer efficiency. This work presents an in-depth study of vertically aligned graphene within the epoxy resin, highlighting the advantages of vertically aligned fillers and offering novel perspectives for the advancement of TIMs.