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具有超高逻辑运算密度的多势垒协作调制器件。

Multibarrier Collaborative Modulation Devices with Ultra-High Logic Operation Density.

作者信息

Pan Jiong, Wu Fan, Wang Zeda, Liu Shangjian, Guo Pengwen, Yin Jiaju, Zhao Bingchen, Tian He, Yang Yi, Ren Tian-Ling

机构信息

School of Integrated Circuits, Tsinghua University, 100084 Beijing, China.

Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, 100084 Beijing, China.

出版信息

ACS Nano. 2024 Oct 15;18(41):28189-28197. doi: 10.1021/acsnano.4c08009. Epub 2024 Oct 3.

Abstract

The demands for highly miniaturized and multifunctional electronics are rapidly increasing. As scaling-down processes of transistors are restricted by physical limits, reconfigurable electronics with switchable operation functions for different tasks are developed for higher function integration based on split- or vertical-dual-gate structures. To promote the present reconfigurable electronics and exceed the function integration limit, the critical issue is to integrate complex operations into simple circuit forms by establishing more control dimensions. This work proposes a multibarrier collaborative (MBC) modulation architecture to increase the control dimension by multiple forms of potential barriers and achieves combinational and reconfigurable logic operations by a single MBC device. The MBC architecture exhibits ultrahigh logic operation density, including 58.8% area reduction for multiplexer operations and 71.4% area reduction for 4-logic reconfigurable operations. Besides, a hardware security module composed of 4 MBC devices implementing 8 types of logic operations is demonstrated. This work reveals an effective design of function integration for next-generation electronics.

摘要

对高度小型化和多功能电子产品的需求正在迅速增长。由于晶体管的缩小过程受到物理限制,基于分裂或垂直双栅结构,开发了具有针对不同任务的可切换操作功能的可重构电子产品,以实现更高的功能集成。为了推动当前的可重构电子产品并突破功能集成限制,关键问题是通过建立更多控制维度,将复杂操作集成到简单的电路形式中。这项工作提出了一种多势垒协同(MBC)调制架构,通过多种形式的势垒增加控制维度,并通过单个MBC器件实现组合和可重构逻辑操作。MBC架构展现出超高的逻辑操作密度,包括多路复用器操作的面积减少58.8%以及4逻辑可重构操作的面积减少71.4%。此外,展示了一个由4个MBC器件组成的硬件安全模块,可实现8种类型的逻辑操作。这项工作揭示了下一代电子产品功能集成的有效设计。

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