Ma Liang, Gong Xiaoshu, Dong Ruikang, Wang Jinlan
Key Laboratory of Quantum Materials and Devices of Ministry of Education, School of Physics, Southeast University, Nanjing 211189, China.
Suzhou Laboratory, Suzhou 215004, China.
Acc Chem Res. 2024 Dec 3;57(23):3375-3385. doi: 10.1021/acs.accounts.4c00495. Epub 2024 Oct 11.
ConspectusTwo-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs), in particular molybdenum disulfide (MoS), have recently attracted huge interest due to their proper bandgap, high mobility at 2D limit, and easy-to-integrate planar structure, which are very promising for extending Moore's law in postsilicon electronics technology. Great effort has been devoted toward such a goal since the demonstration of protype MoS devices with high room-temperature on/off current ratios, ultralow standby power consumption, and atomic level scaling capacity down to sub-1-nm technology node. However, there are still several key challenges that need to be addressed prior to the real application of MoS-based electronics technology. The controllable growth of wafer-scale single-crystal MoS on industry-compatible insulating substrates is the prerequisite of application while the currently synthesized MoS films mostly are polycrystalline with limited sizes of single-crystal domains and may involve metal substrates. The precise layer-control is also very important for MoS growth since its electronic properties are layer-dependent, whereas the layer-by-layer growth of multilayer MoS dominated by the van der Waals (vdW) epitaxy leads to poor thickness uniformity and noncontinuously distributed domains. High density up to 10 cm of sulfur vacancies (SVs) in grown MoS can cause unfavorable carrier scatting and electronic properties variations and will inevitably disturb the device performance. The dangling-bond-free surface of MoS gives rise to an inherent vdW gap at metal-semiconductor (M-S) contact, which leads to high electrical resistance and poor current-delivery capability at the contact interface and thereby substantially limits the performances of MoS devices.In this Account, we briefly review recent experimental and theoretical attempts for addressing the aforementioned challenges and present our own insights from atomistic simulations. We theoretically revealed the vital role of substrate steps for guiding unidirectional nucleation of monolayer MoS and uniform nucleation and edge-aligned growth of bilayer MoS by advanced simulations. The established thermodynamic mechanisms have successfully directed the experimental works on the controllable growth of 2 in. single-crystal monolayer and centimeter-scale uniform bilayer MoS. The postgrowth repair mechanism of SV defect in MoS via thiol chemistry treatment has been theoretically explored with the consideration of side reaction of surface functionalization to help experimentally reduce SV defect density by 75%. Beyond the atomic level understanding, theoretical simulations proposed the electronic states hybridization mechanism across the semimetal-MoS vdW interface, thereby guiding experimental effort for realizing Ohmic contact at the MoS-Sb(0112) vdW interface with record-low contact resistance.These advances provide a sound basis with an atomic-level understanding for addressing the related issues. However, there are still notable gaps in terms of system size and time scale of dynamics between atomistic simulations and experimental observations for the studies of MoS growth and interfaces. The combination of multiscale simulations and artificial intelligence technology is expected to narrow these gaps and provide a more insightful understanding of the controllable growth and interfacial properties modulation of MoS. We conclude the Account with the standing challenges and outlook on future research directions from the theoretical perspective.
综述二维(2D)半导体过渡金属二硫属化物(TMDs),特别是二硫化钼(MoS₂),由于其合适的带隙、二维极限下的高迁移率以及易于集成的平面结构,最近引起了极大的关注,这些特性对于在后硅电子技术中扩展摩尔定律非常有前景。自从展示出具有高室温开/关电流比、超低待机功耗以及原子级缩放能力直至亚1纳米技术节点的原型MoS₂器件以来,人们为实现这一目标付出了巨大努力。然而,在基于MoS₂的电子技术实际应用之前,仍有几个关键挑战需要解决。在与工业兼容的绝缘衬底上可控生长晶圆级单晶MoS₂是应用的前提条件,而目前合成的MoS₂薄膜大多是多晶的,单晶畴尺寸有限,并且可能涉及金属衬底。精确的层数控制对于MoS₂生长也非常重要,因为其电子特性与层数有关,而由范德华(vdW)外延主导的多层MoS₂的逐层生长会导致厚度均匀性差和畴分布不连续。生长的MoS₂中高达10¹² cm⁻²的高密度硫空位(SVs)会导致不利的载流子散射和电子特性变化,并且不可避免地会干扰器件性能。MoS₂无悬键表面在金属 - 半导体(M - S)接触处产生固有vdW间隙,这导致接触界面处的高电阻和较差的电流传输能力,从而极大地限制了MoS₂器件的性能。在本综述中,我们简要回顾了最近为应对上述挑战所做的实验和理论尝试,并展示了我们从原子模拟中获得的见解。我们通过先进模拟从理论上揭示了衬底台阶对于引导单层MoS₂的单向成核以及双层MoS₂的均匀成核和边缘对齐生长的重要作用。所建立的热力学机制已经成功地指导了关于2英寸单晶单层和厘米级均匀双层MoS₂可控生长的实验工作。通过考虑表面功能化的副反应,从理论上探索了通过硫醇化学处理对MoS₂中SV缺陷的生长后修复机制,以帮助实验上将SV缺陷密度降低75%。除了原子级的理解之外,理论模拟提出了跨半金属 - MoS₂ vdW界面的电子态杂化机制,从而指导了在MoS₂ - Sb(0112) vdW界面实现具有创纪录低接触电阻的欧姆接触的实验工作。这些进展为从原子级理解解决相关问题提供了坚实的基础。然而,在MoS₂生长和界面研究的原子模拟与实验观测之间,在系统尺寸和动力学时间尺度方面仍存在显著差距。多尺度模拟与人工智能技术的结合有望缩小这些差距,并对MoS₂的可控生长和界面特性调制提供更深入的理解。我们从理论角度总结了本综述中存在的持续挑战以及对未来研究方向的展望。