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通过原位铁掺杂降低单层二硫化钼的接触电阻并提高器件性能

Reducing Contact Resistance and Boosting Device Performance of Monolayer MoS by In Situ Fe Doping.

作者信息

Li Hui, Cheng Mo, Wang Peng, Du Ruofan, Song Luying, He Jun, Shi Jianping

机构信息

The Institute for Advanced Studies, Wuhan University, Wuhan, 430072, P. R. China.

Key Laboratory of Artificial Micro- and Nano-Structures of Ministry of Education, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China.

出版信息

Adv Mater. 2022 May;34(18):e2200885. doi: 10.1002/adma.202200885. Epub 2022 Apr 3.

Abstract

2D semiconductors are emerging as plausible candidates for next-generation "More-than-Moore" nanoelectronics to tackle the scaling challenge of transistors. Wafer-scale 2D semiconductors, such as MoS and WS , have been successfully synthesized recently; nevertheless, the absence of effective doping technology fundamentally results in energy barriers and high contact resistances at the metal-semiconductor interfaces, and thus restrict their practical applications. Herein, a controllable doping strategy in centimeter-sized monolayer MoS films is developed to address this critical issue and boost the device performance. The ultralow contact resistance and perfect Ohmic contact with metal electrodes are uncovered in monolayer Fe-doped MoS , which deliver excellent device performance featured with ultrahigh electron mobility and outstanding on/off current ratio. Impurity scattering is suppressed significantly thanks to the ultralow electron effective mass and appropriate doping site. Particularly, unidirectionally aligned monolayer Fe-doped MoS domains are prepared on 2 in. commercial c-plane sapphire, suggesting the feasibility of synthesizing wafer-scale 2D single-crystal semiconductors with outstanding device performance. This work presents the potential of high-performance monolayer transistors and enables further device downscaling and extension of Moore's law.

摘要

二维半导体正成为下一代“超越摩尔”纳米电子学应对晶体管缩放挑战的合理候选材料。诸如MoS和WS等晶圆级二维半导体最近已成功合成;然而,缺乏有效的掺杂技术从根本上导致了金属 - 半导体界面处的能垒和高接触电阻,从而限制了它们的实际应用。在此,开发了一种用于厘米级单层MoS薄膜的可控掺杂策略来解决这一关键问题并提高器件性能。在单层铁掺杂的MoS中发现了与金属电极的超低接触电阻和完美欧姆接触,其具有超高电子迁移率和出色的开/关电流比等优异器件性能。由于超低电子有效质量和合适的掺杂位点,杂质散射得到显著抑制。特别地,在2英寸商用c面蓝宝石上制备了单向排列的单层铁掺杂MoS畴,这表明合成具有出色器件性能的晶圆级二维单晶半导体是可行的。这项工作展示了高性能单层晶体管的潜力,并能够进一步缩小器件尺寸并扩展摩尔定律。

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