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用于增强糖尿病伤口愈合的无线、可编程和可再填充水凝胶生物电子器件

Wireless, Programmable, and Refillable Hydrogel Bioelectronics for Enhanced Diabetic Wound Healing.

作者信息

Du Ningjie, Fan Yunlong, Zhang Yunting, Huang Hao, Lyu Yidan, Cai Ruisi, Zhang Yuqi, Zhang Tianyuan, Guan Yixin, Nan Kewang

机构信息

College of Chemical and Biological Engineering, Zhejiang University, 866 Yuhangtang Road, Hangzhou, 310058, China.

College of Pharmaceutical Sciences, Zhejiang University, 866 Yuhangtang Road, Hangzhou, 310058, China.

出版信息

Adv Sci (Weinh). 2024 Dec;11(45):e2407820. doi: 10.1002/advs.202407820. Epub 2024 Oct 14.

Abstract

Diabetic wounds, characterized by complex pathogenesis and high infection rates, pose significant challenges in treatment due to prolonged recovery times and high recurrence rates, often leading to severe complications such as amputation and death. Traditional dry dressing treatments fail to address the unique microenvironment of diabetic wounds and tend to cause secondary damage due to frequent replacement. In this study, an electronic-embedding, drug-loading hydrogel bioelectronics is reported for accelerating diabetic wound healing using a combination of programmable pharmaceutical and electrostimulative approaches. Encapsulated in stretchable and biocompatible materials, this device is capable of multiple drug refilling and accelerated drug release modulated by on-board electronics. In vivo experiments on diabetic model rats confirm the device's effectiveness in promoting wound healing. This innovative approach implies the potential for improving diabetic wound management using a combination of physical, material, and pharmaceutical interventions.

摘要

糖尿病伤口具有发病机制复杂、感染率高的特点,由于恢复时间长和复发率高,在治疗上面临重大挑战,常常导致截肢和死亡等严重并发症。传统的干性敷料治疗无法应对糖尿病伤口独特的微环境,且由于频繁更换往往会造成二次损伤。在本研究中,报道了一种电子嵌入、载药的水凝胶生物电子学,通过可编程药物和电刺激方法的结合来加速糖尿病伤口愈合。该装置封装在可拉伸且生物相容的材料中,能够通过内置电子设备进行多次药物补充和加速药物释放。对糖尿病模型大鼠进行的体内实验证实了该装置在促进伤口愈合方面的有效性。这种创新方法意味着利用物理、材料和药物干预相结合来改善糖尿病伤口管理具有潜力。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/cc4e/11615824/0a1ec75f8486/ADVS-11-2407820-g003.jpg

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