Zheng Weihan, Li Chunlai, Hu Jiangcheng, Guo Liang
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130031, China.
University of Chinese Academy of Sciences, Beijing 100049, China.
Sensors (Basel). 2024 Oct 4;24(19):6428. doi: 10.3390/s24196428.
To explore the bending process and theory of the free-boundary aerodynamic film forming method for curved detectors, this study integrates practical forming structures with theoretical analysis and establishes a simulation model to investigate stress, strain, and morphological changes during bending. The analysis indicates that the shift from "projection" to "wrapping" in forming theory is due to the release of boundary degrees of freedom. The forming process can be summarized as the mold's arc characteristics, originating from the chip's corners, gradually replacing the chip's rectangular characteristics along the diagonal, resulting in corresponding stress and strain changes. The "wrapping" bending theory of this method has significant advantages over traditional methods and represents a crucial direction for achieving higher curvature in the future. However, this study found that the use of film pressure can only inhibit out-of-plane deformation to a certain extent, and the buckling phenomenon will still occur when the thinner chip is bent. It prevents the use of thinner chips in the thinning-bending method, so avoiding out-of-plane deformation during the molding process is the direction that needs to be broken in the future.
为探究曲面探测器自由边界气动成膜法的弯曲过程及理论，本研究将实际成型结构与理论分析相结合，建立了模拟模型，以研究弯曲过程中的应力、应变及形态变化。分析表明，成型理论中从“投影”到“包裹”的转变是由于边界自由度的释放。成型过程可概括为，源于芯片边角的模具弧形特征沿对角线逐渐取代芯片的矩形特征，从而导致相应的应力和应变变化。该方法的“包裹”弯曲理论相较于传统方法具有显著优势，是未来实现更高曲率的关键方向。然而，本研究发现，施加薄膜压力只能在一定程度上抑制面外变形，当较薄芯片弯曲时仍会出现屈曲现象。这使得在减薄弯曲法中无法使用更薄的芯片，因此，在成型过程中避免面外变形是未来需要突破的方向。
