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用于高分辨率光电子学的具有低理想因子的单垂直磷化铟纳米线阵列接触二极管。

Single vertical InP nanowire diodes with low ideality factors contacted in-array for high-resolution optoelectronics.

作者信息

Lamers Nils, Adham Kristi, Hrachowina Lukas, Borgström Magnus T, Wallentin Jesper

机构信息

Division of Synchrotron Radiation Research and NanoLund, Department of Physics, Lund University, Box 118, 22100 Lund, Sweden.

Division of Solid State Physics and NanoLund, Department of Physics, Lund University, Box 118, 22100 Lund, Sweden.

出版信息

Nanotechnology. 2024 Dec 5;36(7). doi: 10.1088/1361-6528/ad96c3.

Abstract

Nanowire (NW) optoelectronic and electrical devices offer unique advantages over bulk materials but are generally made by contacting entire NW arrays in parallel. In contrast, ultra-high-resolution displays and photodetectors require electrical connections to individual NWs inside an array. Here, we demonstrate a scheme for fabricating such single NW vertical devices by contacting individual NWs within a dense NW array. We contrast benzocyclobutene and SiOplanarization methods for these devices and find that the latter leads to dramatically improved processing yield as well as higher-quality diodes. Further, we find that replacing the metal top contact with transparent indium tin oxide does not decrease electrical performance, allowing for transparent top contacts. We improve the ideality factor of the devices from a previous= 14 to= 1.8, with the best devices as low as= 1.5. The devices are characterized as both photodetectors with detectivities up to 2.45 AWand photocurrent densities of up to 185 mAcmunder 0.76 suns illumination. Despite poor performance as light emitting diodes, the devices show great resilience to current densities up to 4 × 10mAcm. In combination with growth optimization, the flexibility of the processing allows for use of these devices as ultra-high-resolution photodetectors and displays.

摘要

纳米线(NW)光电器件和电气设备相对于块状材料具有独特优势,但通常是通过并行接触整个NW阵列来制造的。相比之下,超高分辨率显示器和光电探测器需要与阵列内的单个NW进行电连接。在这里,我们展示了一种通过接触密集NW阵列内的单个NW来制造此类单个NW垂直器件的方案。我们对比了用于这些器件的苯并环丁烯和SiO平面化方法,发现后者可显著提高加工成品率以及二极管的质量。此外,我们发现用透明氧化铟锡代替金属顶部接触不会降低电气性能,从而实现透明顶部接触。我们将器件的理想因子从之前的= 14提高到= 1.8, 最好的器件低至= 1.5。这些器件被表征为光电探测器,在0.76个太阳光照下,探测率高达2.45 AW,光电流密度高达185 mAcm。尽管作为发光二极管性能不佳,但这些器件对高达4 × 10 mAcm的电流密度表现出极大的耐受性。结合生长优化,加工的灵活性允许将这些器件用作超高分辨率光电探测器和显示器。

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