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量化谷光子晶体集成拓扑界面中对急剧弯曲的鲁棒性。

Quantifying robustness against sharp bending in an integrated topological interface of valley photonic crystals.

作者信息

Guo Chao-Heng, Tang Guo-Jing, Li Meng-Yu, Chen Wen-Jie, He Xin-Tao, Dong Jian-Wen

机构信息

School of Physics & State Key Laboratory of Optoelectronic Materials and Technologies, Sun Yat-sen University, Guangzhou 510275, China.

出版信息

Nanophotonics. 2024 Feb 15;13(8):1387-1395. doi: 10.1515/nanoph-2023-0727. eCollection 2024 Apr.

Abstract

Sharp-bending waveguide is a key element for ultra-compact and densely integrated photonic devices, which is promising to enlarge the capability of modern information processing in a single chip. Topological photonics manifest the nature of robust propagation against sharp bending and such robustness has been experimentally demonstrated in topological integrated interfaces. It is important to quantify the bending loss of topological interface but has remained exclusive. In this work, we report on the characterization of sharp-bending robustness in the integrated topological interface of valley photonic crystals (VPCs) by experimentally quantifying the ultralow bending loss. The VPCs are designed on a standard silicon-on-insulator platform with the inversion-symmetry broken in honeycomb lattice, and four types of topological interfaces can be constructed by two topologically-distinct VPCs. As one of the representative cases, zigzag-AA interface is applied to demonstrate the robust propagation along sharp bending. In experiment, we fabricate a series of VPC interfaces with different turn number and the same transmission distance, which perform the ultralow bending loss less than 0.02 dB per 120-deg turning. Furthermore, we experimentally characterize the propagation loss in the integrated interfaces. Our approach not only shows the ability of VPC topological interfaces to suppress backscattering stemming from sharp bending, but also paves the way for topological nanophotonic dense integration.

摘要

锐弯波导是超紧凑和高密度集成光子器件的关键元件,有望在单个芯片中提升现代信息处理能力。拓扑光子学展现出对锐弯具有鲁棒传播的特性,且这种鲁棒性已在拓扑集成界面中得到实验验证。量化拓扑界面的弯曲损耗很重要,但一直未得到解决。在这项工作中,我们通过实验量化超低弯曲损耗,报道了谷光子晶体(VPC)集成拓扑界面中锐弯鲁棒性的表征。VPC是在标准绝缘体上硅平台上设计的,蜂窝晶格中的反演对称性被打破,两种拓扑不同的VPC可构建四种类型的拓扑界面。作为一个典型案例,锯齿形-AA界面被用于展示沿锐弯的鲁棒传播。在实验中,我们制作了一系列具有不同转弯数和相同传输距离的VPC界面,其每120度转弯的超低弯曲损耗小于0.02 dB。此外,我们对集成界面中的传播损耗进行了实验表征。我们的方法不仅展示了VPC拓扑界面抑制锐弯引起的背向散射的能力,还为拓扑纳米光子密集集成铺平了道路。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d018/11636300/c424607f3c7b/j_nanoph-2023-0727_fig_001.jpg

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