Ren Xiaona, Chang Yue, Ge Changchun
School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China.
Int J Mol Sci. 2024 Dec 2;25(23):12957. doi: 10.3390/ijms252312957.
Carbon nanotubes (CNTs)-reinforced copper-based composites (CNT/Cu) have been extensively investigated due to their exceptional theoretical electrical, thermal, and mechanical properties. However, the actual performance of these composites has consistently fallen short of theoretical expectations. This discrepancy primarily arises from the inability to achieve direct chemical bonding between copper and carbon nanotubes or to alloy them effectively. Consequently, this leads to interference in electron and phonon transmission at the interface between the two materials, adversely affecting their electrical and thermal conductivity as well as other properties. In recent years, research has increasingly focused on optimizing and regulating the interfacial interactions between carbon nanotubes and the copper matrix to enhance overall performance while also exploring potential applications. This article reviews recent advancements from an interface regulation perspective, summarizing typical interfacial characteristics such as physical interfaces, chemical bonding, and metallurgical bonding along with their respective preparation methods and effects on performance enhancement. Furthermore, a novel microstructural design of CNT/Cu is put forward, where amorphous CNTs (aCNTs) were utilized as the reinforcing phase to form a nanoscale networked composite interface. This not only enables Cu to adhere to the aCNTs' sidewall but also fills the sidewall within them, with the aim of significantly strengthening the interfacial bonding strength of CNT/Cu and achieving comprehensive improvement of the composite material properties.
碳纳米管（CNTs）增强铜基复合材料（CNT/Cu）因其优异的理论电学、热学和力学性能而受到广泛研究。然而，这些复合材料的实际性能一直未达到理论预期。这种差异主要源于无法实现铜与碳纳米管之间的直接化学键合或有效合金化。因此，这导致两种材料界面处的电子和声子传输受到干扰，对其电导率、热导率以及其他性能产生不利影响。近年来，研究越来越集中于优化和调节碳纳米管与铜基体之间的界面相互作用，以提高整体性能，同时探索潜在应用。本文从界面调控的角度综述了近期的进展，总结了诸如物理界面、化学键合和冶金结合等典型界面特征及其各自的制备方法以及对性能增强的影响。此外，还提出了一种新型的CNT/Cu微观结构设计，其中利用非晶态碳纳米管（aCNTs）作为增强相来形成纳米级网络化复合界面。这不仅使铜能够附着在aCNTs的侧壁上，还能填充其内部的侧壁，旨在显著增强CNT/Cu的界面结合强度并实现复合材料性能的全面提升。
